Via Pad Conductor Gradient Thickness for Substrate Airtightness

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Solution Overview

Problem

Existing electronic component mounting substrates face challenges in maintaining airtightness and reliability due to stress-induced gaps between the insulating substrate and via conductors, particularly during handling and in high-power or thin electronic devices.

Innovation Solution

The electronic component mounting substrate features a via pad conductor with a thickness that gradually increases from the outer edge to the inside portion, including a protruding portion that extends from the via conductor, effectively dispersing stress and maintaining airtightness by preventing gaps between the insulating substrate and via conductors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the via conductor is made thin to reduce device thickness, then the device thickness is reduced, but stress concentration occurs causing gaps between the insulating substrate and via conductor

Engineering Contradiction:

Improvedevice thicknessVSAvoidairtightness

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The via pad conductor is designed with non-uniform thickness, being thicker at the outer edge portion and thinner at the inner edge portion. This local variation in thickness allows the structure to better distribute stress locally, preventing gap formation between the insulating substrate and via conductor while maintaining overall thinness of the device.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The thickness parameter of the via pad conductor is changed from a uniform value to a gradient distribution, where the thickness varies from the outer edge to the inner edge. This parameter change enables the via pad conductor to accommodate stress variations and prevent gap formation while keeping the device thin.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If the via pad conductor thickness is increased to prevent gaps, then airtightness is improved, but stress concentration occurs at the inner edge portion

Engineering Contradiction:

ImproveairtightnessVSAvoidstress distribution

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The via pad conductor employs local quality variation with different thicknesses at different locations. The outer edge portion has greater thickness to provide overall structural support and prevent gaps, while the inner edge portion has reduced thickness to minimize stress concentration, achieving both airtightness and stress distribution.

Inventive Principle:

Principle #3Local quality

3Length of moving object

If the electronic device is made thin for portability, then device thickness is reduced, but handling stress causes gap formation between substrate and via conductors

Engineering Contradiction:

Improvedevice thicknessVSAvoidhandling stress

Core Design Contradiction:

Length of moving objectVSObject-affected harmful factors

Solution Approach 1:

The via pad conductor's thickness parameter is changed from uniform to gradient distribution, with the outer edge being thicker than the inner edge. This parameter modification allows the thin device to better withstand handling stress by distributing forces more effectively, preventing gap formation while maintaining portability.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentEP3678196B1Substrate for mounting electronic components, electronic device, and electronic module

Publication Date: 2023.07.05 KYOCERA CORP

Figure 1(a)~1(b)
Figure 2(a)~2(b)
Figure 3(a)~3(b)

AI summary

An electronic component mounting substrate including: an insulating substrate for mounting an electronic component; a via conductor disposed in the insulating substrate in an thickness direction of the insulating substrate; and a via pad conductor disposed in the insulating substrate, connected to the via conductor, having a thickness gradually increasing from an outer edge portion toward an inside portion, and including a protruding portion protruding from the via conductor in a width direction of the via conductor.