Via Pad Structure for Stacked Semiconductor Reliability
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Solution Overview
Problem
Existing semiconductor devices face challenges in improving the reliability and yield of stacked semiconductor devices due to issues with conductive vias, which affect the transmission speed and reliability of electrical signals.
Innovation Solution
A semiconductor device design that includes a substrate with an insulating layer having a trench, a via structure penetrating the substrate, and a conductive structure surrounding the via structure, along with a pad structure that increases the contact area with the insulating layer to reduce stress and improve adhesive strength, thereby enhancing the reliability and manufacturing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional via structures are used in stacked semiconductor devices, then manufacturing process is simple, but reliability and electrical signal transmission speed deteriorate due to stress concentrations and poor adhesive strength
Solution Approach 1:
The via structure is segmented into multiple components: a via body penetrating the substrate, a protrusion extending from the via body, and a pad structure surrounding the protrusion. This segmentation allows each component to perform its specific function optimally, improving overall reliability while managing complexity through functional specialization.
Solution Approach 2:
The via structure extends in multiple dimensions: vertically through the substrate via the via body, and horizontally through the protrusion that extends laterally. This multi-dimensional configuration increases the contact area with the insulating layer and distributes stress more effectively, enhancing reliability without simply increasing size in one direction.
2Strength
If conventional pad structures are used, then manufacturing process is simple, but adhesive strength and stress distribution deteriorate
Solution Approach 1:
The protrusion is formed as an extension of the via body before the pad structure is created. This preliminary formation of the protrusion provides a pre-prepared interface that enhances adhesive strength with the insulating layer, as the pad structure is subsequently formed to surround this already-positioned protrusion, ensuring optimal bonding conditions.
Solution Approach 2:
The pad structure is designed with non-uniform geometry, being wider at the top than at the bottom, creating different local qualities: the upper portion provides large contact area for strong adhesion to the insulating layer, while the lower portion maintains proper spacing and stress distribution near the via body. This local variation in geometry optimizes both adhesive strength and stress distribution.
Data Source
AI summary
A semiconductor device including a substrate, an insulating layer on the substrate and including a trench, at least one via structure penetrating the substrate and protruding above a bottom surface of the trench, and a conductive structure surrounding the at least one via structure in the trench may be provided.