Via Placement in Integrated Circuit Routing Layouts

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Solution Overview

Problem

The formation of power grid conductors and power connection vias before routing conductors and connection vias in integrated circuits limits the freedom in placing routing connection vias, making it difficult to achieve an efficient routing solution due to minimum via spacing requirements.

Innovation Solution

The method involves forming the routing layout and routing connection vias first, followed by positioning power grid connection vias to meet the minimum via spacing requirement, allowing for greater flexibility and efficiency in placing power connection vias.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of time

If power grid conductors and power connection vias are formed before routing conductors and connection vias, then the power grid layout can be established early in the design process, but the freedom in placing routing connection vias is limited due to minimum via spacing requirements

Engineering Contradiction:

Improvedesign process timeVSAvoidfreedom in placing routing connection vias

Core Design Contradiction:

Loss of timeVSAdaptability or versatility

Solution Approach 1:

The patent inverts the conventional sequence by performing the routing step before the power grid connection step. This allows routing connection vias to be placed first without constraints from pre-placed power connection vias, and then power connection vias are positioned to connect to standard-cell power conductors while respecting the minimum via spacing requirements relative to the already-placed routing connection vias.

Inventive Principle:

Principle #13The other way round (Inversion)

2Ease of manufacture

If power connection vias are placed before routing connection vias, then the power grid can be established early, but it becomes difficult to achieve an efficient routing solution

Engineering Contradiction:

Improvepower grid establishmentVSAvoidrouting solution efficiency

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent applies sequence inversion by executing routing operations before power grid connection operations. This ensures that routing connection vias are placed with full freedom to achieve optimal routing efficiency, and subsequently power connection vias are added to connect power grid conductors to standard-cell power conductors while maintaining compliance with minimum via spacing requirements.

Inventive Principle:

Principle #13The other way round (Inversion)

3Reliability

If power connection vias are positioned to meet minimum via spacing requirements from routing connection vias, then design rule violations are prevented, but the placement flexibility is reduced

Engineering Contradiction:

Improvedesign rule complianceVSAvoidvia placement flexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies preliminary action by completing the routing step and placing all routing connection vias before proceeding to the power grid connection step. This preliminary placement of routing connection vias establishes a fixed reference framework that allows power connection vias to be subsequently positioned with full knowledge of existing via locations, ensuring minimum via spacing requirements are met while maintaining optimal placement flexibility for power connections.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS10204894B2Via placement within an integrated circuit

Publication Date: 2019.02.12 ARM LTD

AI summary

An integrated circuit layout includes a routing layout of routing conductors and routing connection vias formed prior to a power grid connection which forms power connection vias between power grid conductors and standard-power cell conductors within the standard cells. This enables a minimum via spacing requirement to be met while permitting an increased flexibility in the positioning of the routing connection vias.