Via Plug Formation Using Mandrel Templates for High Density Packaging
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Solution Overview
Problem
The challenge in manufacturing semiconductor devices is the difficulty in forming high-aspect-ratio via plugs for connecting passive elements, which are larger in height than active elements, using conventional plating methods, making it hard to achieve smaller size and higher density in semiconductor devices with radio communication modules.
Innovation Solution
A method involving the formation of via plugs on an electrically conductive layer, embedding them in an insulation layer to create a wiring structure, and bonding this structure to a wiring substrate with electronic components, allowing for the reduction in size and increase in density of semiconductor devices by enabling easier connection of elements with varying heights.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional plating methods are used to form via plugs, then the manufacturing process is simple, but it becomes difficult to form high-aspect-ratio via plugs needed for connecting passive elements with varying heights
Solution Approach 1:
The patent applies preliminary action by forming a mandrel structure before the via plug formation. The mandrel is first formed in the insulation layer, providing a pre-established template that guides the subsequent via plug formation process. This preliminary structure enables the formation of high-aspect-ratio via plugs that would be difficult to create directly through conventional plating methods alone.
Solution Approach 2:
The mandrel acts as an intermediary object in the via plug formation process. It serves as a temporary structure that facilitates the formation of the final via plug, particularly enabling high-aspect-ratio configurations. The mandrel is formed first, then the via plug is formed around or using the mandrel as a guide, and finally the mandrel is removed, leaving the desired via plug structure.
2Adaptability or versatility
If passive elements with larger heights are mounted on the wiring substrate, then the radio communication module functionality is achieved, but the insulation layer thickness increases making via plug formation difficult
Solution Approach 1:
The mandrel is formed in advance before the via plug formation, creating a pre-established template that accommodates the varying heights of passive elements. This preliminary structure allows the via plug to be formed with the necessary high aspect ratio to reach through the thick insulation layer, solving the problem of connecting elements with different heights while maintaining manufacturing feasibility.
Solution Approach 2:
The patent changes the parameters of the via plug formation process by using a mandrel-based approach instead of direct plating. This allows the via plug to achieve the required high aspect ratio parameters that would be difficult to obtain through conventional methods, thereby accommodating the increased insulation layer thickness caused by taller passive elements.
3Reliability
If the insulation layer is made thicker to seal passive elements with larger heights, then element sealing is improved, but via plug formation becomes more difficult
Solution Approach 1:
The mandrel serves as an intermediary structure that enables via plug formation through thick insulation layers. By forming the mandrel first, it provides a physical template that guides the via plug formation process, making it feasible to create high-aspect-ratio via plugs that penetrate the thick insulation layer required for sealing tall passive elements, thus maintaining both sealing reliability and manufacturing feasibility.
Solution Approach 2:
The preliminary formation of the mandrel structure prepares the pathway for via plug formation through the thick insulation layer. This advance preparation allows the subsequent via plug formation to proceed more easily, maintaining manufacturing feasibility even when the insulation layer thickness is increased to properly seal passive elements with larger heights.
Data Source
AI summary
A method for manufacturing a semiconductor device includes: a step of forming a via plug erected on an electrically conductive layer, and embedding the via plug in an insulation layer to form a wiring structure; and a step of bonding the wiring structure to a wiring substrate including electronic components mounted thereon.