Embedded Via Plug Resistors to Replace SMD Package Components
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Solution Overview
Problem
Current surface mounted devices (SMDs) in integrated circuit packages result in high production costs, large footprints, and high failure rates, along with difficulties in troubleshooting and environmental impact concerns.
Innovation Solution
The use of via plug resistors and capacitors, which are embedded within the vias of an electronic substrate, reducing the need for SMDs and offering improved reliability, cost savings, and environmental sustainability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If surface mounted devices (SMDs) are used in integrated circuit packages, then various electronic functions can be implemented, but production costs increase, footprint increases, and failure rates increase
Solution Approach 1:
The patent merges multiple discrete SMD components into a single integrated circuit package. The package contains an integrated circuit die with multiple functional blocks (logic block, memory block, I/O block) that replace what would traditionally require multiple separate SMD components. This consolidation reduces the number of components, decreases footprint, and improves reliability by eliminating inter-component interconnections.
Solution Approach 2:
The patent employs a nested structure where the integrated circuit die is embedded within the package substrate. The die is positioned in a cavity and connected to external pins through internal vias and trace structures. This nesting approach allows multiple functional elements to be contained within a single package, reducing the overall component count and improving system reliability.
2Ease of manufacture
If surface mounted devices (SMDs) are used in integrated circuit packages, then electronic functions can be implemented, but production costs increase due to pick and place operations, solder operations, and inventory management
Solution Approach 1:
The patent combines multiple discrete components into a single integrated package that can be manufactured as one unit. The package substrate is prepared with pre-formed vias and trace structures, and the integrated circuit die is mounted and connected in a single manufacturing process flow. This eliminates the need for separate pick-and-place and soldering operations for each component, significantly reducing production costs and manufacturing complexity.
3Area of stationary object
If surface mounted devices (SMDs) are used in integrated circuit packages, then electronic functions can be implemented, but the footprint on the assembly increases
Solution Approach 1:
The patent consolidates multiple discrete SMD components into a single integrated circuit package with a unified external form factor. The package has a compact housing that contains all functional blocks (logic, memory, I/O) and their interconnections internally. This integration dramatically reduces the footprint compared to mounting separate components, as the entire functionality is contained within one small package that mounts to the circuit board as a single unit.
4Ease of repair
If surface mounted devices (SMDs) are used in integrated circuit packages, then electronic functions can be implemented, but troubleshooting difficulty increases when failures arise
Solution Approach 1:
The patent integrates multiple functional blocks within a single package, which simplifies troubleshooting by reducing the number of potential failure points. Instead of having to diagnose issues across multiple separate components and their interconnections, the integrated architecture consolidates all functions into one unit with internal connections that are factory-tested. This makes it easier to identify and replace a single defective package rather than troubleshooting multiple discrete components.
Data Source
AI summary
Disclosed herein are via plug resistors for incorporation into electronic substrates, and related methods and devices. Exemplary via plug resistor structures include a resistive element within and on a surface of a via extending at least partially through an electronic substrate and first and second electrodes coupled to the resistive element.