Via Segmentation for Heat Dissipation in Electronic Substrates
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Solution Overview
Problem
Existing electronic component mounting substrates face challenges in efficiently dissipating heat and reducing stress on insulating substrates due to uneven current distribution and heat generation, leading to potential distortion and reduced reliability, especially in high-power applications.
Innovation Solution
The electronic component mounting substrate features a recess with a metal layer on its bottom surface, external electrodes on the opposite surface, connection wiring through the substrate thickness, and strategically arranged first and second vias along the side walls and in a strip shape, respectively, to separate heat sources and distribute current effectively, thereby reducing stress and distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional via arrangements are used to connect metal layer and external electrode, then current can be transmitted, but heat accumulates unevenly causing substrate distortion and stress
Solution Approach 1:
The via structure is segmented into two distinct groups: first vias arranged along the side wall of the recess for initial current transmission, and second vias arranged in a strip shape for additional current paths. This segmentation distributes heat generation across multiple separated locations rather than concentrating it in a single via region, thereby reducing thermal accumulation and substrate distortion.
Solution Approach 2:
Different via arrangements are applied to different regions: the first vias are positioned along the side wall where heat generation occurs, while the second vias are positioned in a strip shape to provide alternative current paths. This local differentiation optimizes heat dissipation in specific high-heat regions while maintaining overall current distribution.
2Reliability
If current is concentrated in single via path, then connection is simple, but heat generation causes stress and reduces reliability
Solution Approach 1:
The current path is divided into multiple segments through the first and second via groups, creating redundant current transmission routes. This segmentation ensures that if one via path experiences high current density, the other paths can share the load, improving reliability without requiring a completely complex via structure.
Solution Approach 2:
The via arrangement transitions from a single linear path to a two-dimensional distribution pattern with first vias along the side wall and second vias in a strip shape. This dimensional expansion provides multiple current transmission routes while maintaining a relatively simple overall structure that can be integrated into existing substrate designs.
3Temperature
If vias are arranged to maximize current distribution, then heat dissipation improves, but manufacturing precision requirements increase
Solution Approach 1:
The via arrangement applies different positioning strategies to different via groups: first vias are positioned along the side wall of the recess where heat generation occurs, and second vias are positioned in a strip shape. This localized positioning approach optimizes current distribution in critical heat-generating regions while using simpler geometric patterns that are easier to manufacture with standard precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances long-term reliability and heat dissipation, allowing for the use in small and high-power devices, including light emitting elements, by separating heat sources and distributing current evenly, thus reducing distortion and stress on the insulating substrate.
Implementation Method 1
a plurality of first vias that connects the metal layer and the connection wiring and that is located along a side wall of the recess in a perspective plan view, and a plurality of second vias that connects the connection wiring and the external electrode
Implementation Method 2
separately located, thereby making it possible to reduce occurrence of distortion in the insulating substrate even when a high current flows
Data Source
AI summary
An electronic component mounting substrate includes: an insulating substrate having a recess that opens in a main surface of the insulating substrate, the recess for mounting an electronic component; a metal layer located on a bottom surface of the recess; an external electrode located on the other main surface of the insulating substrate, the other main surface opposite to the main surface; a connection wiring located between the metal layer and the external electrode in a thickness direction of the insulating substrate; a plurality of first vias that connects the metal layer and the connection wiring and that is located along a side wall of the recess in a perspective plan view; and a plurality of second vias that connects the connection wiring and the external electrode and that is located in a strip shape in the perspective plan view.