Quantum Chip Via Sidewall Coating with Tilted Rotational Deposition
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Solution Overview
Problem
Existing coating methods for quantum chips, particularly those using physical vapor deposition, struggle to achieve continuous and sufficient deposition of superconducting materials on the sidewalls of high aspect ratio and high verticality holes, which is crucial for microwave transmission.
Innovation Solution
A coating method that involves controlling the included angle between the substrate plane and the deposition direction of the coating material to be between 0 and 90 degrees, combined with substrate rotation, to enable the coating material to enter the sidewall of the hole obliquely, using a coating device with adjustable inclination and rotation systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If physical vapor deposition is used to coat superconducting materials on through silicon via sidewalls, then the coating process can be completed, but the deposition continuity and thickness on the sidewall are insufficient
Solution Approach 1:
The substrate is rotated during the deposition process, dynamically changing the angle between the deposition direction and the sidewall surface. This dynamic adjustment allows the coating material to continuously deposit on the sidewall, improving both deposition continuity and thickness while ensuring reliable microwave transmission performance
Solution Approach 2:
The included angle between the substrate plane and deposition direction is changed from a fixed value to a variable parameter that changes during deposition. By controlling the substrate rotation, the deposition angle parameter is continuously adjusted to optimize coating quality on the sidewall, resolving the contradiction between deposition quality and transmission reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves deposition continuity and thickness of the coating material on the sidewall, meeting the requirements for thickness and coverage rate of the thin film, especially for superconducting quantum chips, enhancing microwave transmission capabilities.
Implementation Method 1
Superconducting materials (such as aluminum, niobium, and titanium nitride) commonly used in a quantum chip are mostly coated in a direction perpendicular to a chip substrate by using a physical vapor deposition (PVD) method
Data Source
AI summary
This application discloses a coating method for making a chip. The method includes: fixing a substrate on a base. The substrate includes a hole. The method includes controlling an included angle between a plane on which the substrate is located and a deposition direction of a coating material to be greater than 0 degrees and less than 90 degrees. The method includes controlling the substrate to rotate with respect to an axis perpendicular to the plane on which the substrate is located. The method includes during the rotation of the substrate, controlling the coating material to enter the hole along the deposition direction such that the coating material is deposited on a sidewall of the hole.