Via Spacer Current Sensing in Power Modules With Better Heat Control

The patent extracts the resistive element from the traditional substrate integration approach and relocates it to the via spacer structure. This extraction allows the resistive element to be positioned vertically between substrates rather than being planarly integrated, which improves heat management by separating the sensing function from the main current conduction paths while reducing the formation of harmful current loops.

The via spacer acts as an intermediary structure that performs multiple functions: it provides mechanical support, establishes electrical connection between substrates, and hosts the resistive element for current sensing. By using the via spacer as a mediator, the patent integrates current sensing capability without directly integrating resistive elements into the substrate, thereby avoiding the heat management issues and current loop problems associated with traditional integration methods.

The patent merges multiple functions into the via spacer structure: mechanical support, electrical connection between substrates, and current sensing through the integrated resistive element. This consolidation eliminates the need for separate external current sensors and reduces device complexity while maintaining effective heat management and avoiding current loop issues.

The via spacer is designed as a multi-functional component that simultaneously provides structural support, electrical connectivity, and sensing capabilities. By making the via spacer universal in its functionality, the patent reduces the overall device complexity and component count compared to using separate dedicated current sensors.