Via-Integrated Stiffener Member for Chip Package Warpage Control
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Solution Overview
Problem
Traditional stiffener rings in semiconductor packages are purely mechanical and lack electrical features, leading to space competition with connectors and increased warpage due to thermal expansion mismatches.
Innovation Solution
Incorporating a stiffener member with one or more vias that provides both mechanical restraint and electrical connections between the substrate and connectors, thereby controlling warpage and optimizing space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional mechanical stiffener rings are used, then mechanical restraint is provided, but space is consumed and electrical connectivity is lacking
Solution Approach 1:
The patent combines the mechanical stiffener ring with electrical vias into a single integrated component. The stiffener ring serves dual purposes: providing mechanical restraint to control warpage and containing electrical vias that conduct signals between the substrate and connector, thereby eliminating the need for separate electrical connection elements and optimizing space utilization.
Solution Approach 2:
The stiffener ring is designed as a multi-functional element that simultaneously performs mechanical support (restraint) and electrical connection functions. By incorporating vias through the stiffener ring, a single component achieves multiple objectives that previously required separate elements, thus improving adaptability without increasing area.
2Adaptability or versatility
If connectors and connections are added to chip packages, then electrical functionality is improved, but space for mechanical stiffener ring is reduced
Solution Approach 1:
The patent merges the stiffener ring with electrical connection features by integrating vias into the stiffener structure. This allows the stiffener ring to coexist with connectors and connections without competing for additional space, as the electrical connectivity is achieved through the stiffener itself rather than through separate dedicated connection elements.
3Adaptability or versatility
If purely mechanical stiffener rings are used, then manufacturing simplicity is maintained, but electrical features are lacking
Solution Approach 1:
The integration of vias into the stiffener ring combines two manufacturing processes (stiffener fabrication and via creation) into a single unified structure. This approach adds electrical features while minimizing manufacturing complexity by creating the electrical pathways as an integral part of the stiffener ring rather than as separate components requiring additional assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stiffener member with vias effectively reduces warpage by controlling thermal expansion and provides electrical connectivity, addressing the limitations of traditional mechanical stiffener rings.
Implementation Method 1
a via extends through a body of the member. The via couples to the connector and to the substrate
Implementation Method 2
chip package warpage can be high due to a coefficient of thermal expansion mismatch between a substrate and circuit board
Data Source
AI summary
Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package or a chip package including a stiffener member with a via. In various embodiments, an apparatus includes a substrate and a connector electrically coupled to the substrate. A stiffener member is disposed between the substrate and the connector and configured to restrain at least one of the substrate or the connector. A via extends through a body of the stiffener member and electrically couples the connector to the substrate.