Vias Through Modular Components for PCB Interconnect
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Solution Overview
Problem
In electrical systems, components stacked on top of modules can be isolated from the printed circuit board (PCB) due to the module blocking wiring paths, preventing communication and coupling between components, especially in devices where space is limited in the x and y-directions but available in the z-direction.
Innovation Solution
The implementation of vias that extend through modules, acting as conductive pathways to bypass internal module elements, allowing stacked components to directly connect to the PCB and other components, along with edge-plated vias that provide electrical pathways on the surface for interconnects, enabling communication and coupling without occupying additional PCB space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If components are stacked on top of modules to reduce x-y footprint, then space utilization in the z-direction is improved, but electrical connectivity between stacked components and PCB is lost
Solution Approach 1:
The patent introduces vias that extend in the z-direction (vertically through the module) to provide electrical connectivity between stacked components and the PCB. This dimensional transition allows components to be stacked in the z-direction while maintaining electrical connectivity, effectively resolving the contradiction between reduced x-y footprint and maintained connectivity.
Solution Approach 2:
The via acts as an intermediary element that bridges the gap between stacked components and the PCB. By providing a dedicated conductive pathway through the module structure, the via enables electrical connectivity without requiring direct contact or modification of the stacked component's interface with the PCB.
2Reliability
If vias extend through modules to provide connectivity, then electrical connectivity is improved, but module structure complexity increases
Solution Approach 1:
The vias are pre-formed as integral parts of the module structure during manufacturing, rather than being added as separate post-processing elements. This preliminary integration of via structures into the module fabrication process minimizes additional complexity while ensuring reliable electrical connectivity.
Data Source
AI summary
This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.