Vibrating Chip Pick-Up Head for Low-Stress Wafer Detachment
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Solution Overview
Problem
Existing chip detachment methods face challenges in stably picking up chips from adhesive films without applying excessive stress, which can lead to chip damage and reduced reliability in semiconductor packaging.
Innovation Solution
A chip pick-up head with a collet and vibration generator is used to detach and pick up chips, employing vacuum adsorption and vibration to minimize stress and prevent cracks, while an ejector stage assists in lifting and positioning the chip for efficient detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional chip detachment methods are used, then chips can be picked up from adhesive films, but excessive stress is applied to chips causing damage and reduced reliability
Solution Approach 1:
The patent applies ultrasonic vibration to the pick-up head during chip detachment. The vibration module generates ultrasonic waves that are transmitted to the pick-up head, creating mechanical vibration that reduces the adhesion force between the chip and adhesive film. This allows the chip to be detached with minimal stress, preventing chip damage and improving reliability while maintaining effective detachment.
2Reliability
If vacuum adsorption is used to pick up chips, then chips can be detached from adhesive films, but the process lacks stability leading to inconsistent pick-up results
Solution Approach 1:
The ultrasonic vibration applied to the pick-up head creates consistent oscillatory motion that stabilizes the detachment process. The vibration frequency and amplitude are controlled to ensure uniform interaction between the pick-up head and chip surface, leading to consistent pick-up results across different chips and operations.
Solution Approach 2:
The patent controls the vibration parameters (frequency, amplitude, duration) to optimize the detachment process. By adjusting these parameters, the system achieves stable and repeatable chip pick-up while adapting to different chip types and adhesive film conditions, improving both reliability and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces stress on chips during detachment, minimizing crack generation and improving the reliability of chip pick-up and semiconductor packaging processes.
Implementation Method 1
a chip pick-up head configured to detach and pick up the chip from the adhesive film by vacuum adsorption and vibration
Implementation Method 2
a vibration generator coupled to the vibration transfer rod and configured to generate the vibration
Data Source
AI summary
A chip pick-up head includes a collet in contact with an upper surface of a chip of a diced wafer. The chip pick-up head detaches and picks up the chip from an adhesive film. The chip pick-up head further includes a head part coupled to the collet, a vibration transfer rod coupled to the head part and configured to transfer a vibration to the head part and the collet, and a vibration generator coupled to the vibration transfer rod and configured to generate the vibration.