Vibrating Heat Sink Base for Enhanced Thermal Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat sinks are limited in their effectiveness due to design considerations such as thermal conductivity and heat capacity, and vibration-enhanced heat sinks are limited by the application of vibration to cooling fins or liquid reservoirs, necessitating a more efficient method for heat dissipation in high-power electronic devices.
Innovation Solution
A heat sink with a vibrating base formed from high thermal conductivity material, where the material can partially liquefy to form a conductive melted layer, enhancing heat transfer through conduction and convection, and the vibrating base applies oscillating waves to increase the surface area of contact and transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional heat sinks are used with direct contact between base and heat source, then heat transfer occurs through conduction, but heat dissipation effectiveness is limited by material thermal conductivity and heat capacity
Solution Approach 1:
The patent applies mechanical vibration to the heat sink base to enhance heat transfer from the heat source. The vibration creates dynamic contact between the heat sink base and heat source surface, increasing the effective contact area and disrupting thermal boundary layers, thereby overcoming the limitations of static material thermal conductivity and heat capacity.
Solution Approach 2:
The invention transitions from a static heat sink design to a dynamic one by introducing vibrational motion. This dynamic approach allows the heat sink to adapt its contact characteristics with the heat source, optimizing heat transfer conditions continuously rather than relying on fixed material properties.
2Productivity
If vibration is applied to cooling fins or liquid reservoirs in existing heat sinks, then heat transfer is enhanced, but the system complexity increases and the vibration application becomes more difficult
Solution Approach 1:
The patent extracts the vibration function from complex cooling fin or liquid reservoir systems and concentrates it in the heat sink base. By applying vibration directly at the heat source interface, the invention simplifies the overall system while maintaining or enhancing heat transfer effectiveness, avoiding the complexity of vibrating multiple components.
Solution Approach 2:
The heat sink base acts as an intermediary that receives vibration input and translates it into enhanced heat transfer at the contact interface with the heat source. This intermediary approach allows vibration to be applied efficiently at one location rather than requiring complex distributed vibration mechanisms throughout the heat sink structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vibrating heat sink significantly increases heat transfer rates by generating active dynamic molecular motion, dilating the contact interface and enhancing the surface area, leading to quicker and more efficient heat dissipation from high-power electronic components.
Implementation Method 1
heat generated by the heat source is transferred, via conduction, into the first body of high thermal conductivity material
Implementation Method 2
enhancing heat transfer through conduction and convection
Implementation Method 3
The vibrating base may apply oscillating waves, propagating through the thermally conductive housing and/or the first body of high thermal conductivity material
Data Source
AI summary
The heat sinks with vibration enhanced heat transfer are heat sinks formed from a first body of high thermal conductivity material. The first body of high thermal conductivity material is received within a thermally conductive housing such that at least one contact face of the first body of high thermal conductivity material is exposed, forming a direct contact interface with a heat source requiring cooling. The heat source requiring cooling may be a liquid heat source, including but not limited to water. The thermally conductive housing is disposed such that at least one contact face of the thermally conductive housing is in direct contact with the vibrating base. The vibrating base applies oscillating waves to the heat sink, thereby increasing heat transfer between the heat source and the heat sink.