Vibrating Laser Spot Control for Low-Damage Semiconductor Cutting
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Solution Overview
Problem
Current semiconductor cutting methods, such as blade dicing and stealth dicing, face issues like chipping and performance degradation due to heat accumulation and high peak power laser beams, which affect the quality and yield of semiconductor chips.
Innovation Solution
A laser beam irradiation device that vibrates the laser beam at a constant amplitude in a direction different from the processing direction to reduce heat accumulation, using a combination of a laser oscillator, vibrator, and condenser lens to control the laser spot and angle of incidence, allowing for precise control of vibration speed and amplitude based on user modes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a laser beam with extremely high peak power is used for stealth dicing to form internal cracks, then cutting capability is improved, but cracks occur in the surface of the semiconductor resulting in performance degradation
Solution Approach 1:
The patent applies vibration to the laser beam delivery system (either vibrating the beam path or the focal point) to dynamically modulate the laser energy distribution. This prevents stationary heat accumulation at any single point while maintaining the high peak power necessary for internal crack formation, thereby avoiding surface cracking and performance degradation.
Solution Approach 2:
The laser beam is applied in a periodic manner through vibration, creating alternating periods of high energy concentration (for internal crack formation) and movement (for heat dissipation). This periodic action allows the laser to form internal cracks effectively while preventing excessive heat buildup that would cause surface damage.
2Productivity
If a stationary laser beam is concentrated on a local area for cutting, then cutting efficiency is improved, but heat energy accumulates causing optical damage to the semiconductor
Solution Approach 1:
By introducing vibration to the laser beam system, the patent transforms the stationary high-energy concentration into a dynamic process. The laser beam rapidly moves or oscillates within the cutting zone, maintaining high cutting efficiency through sustained energy input while preventing localized heat accumulation that would cause optical damage.
Solution Approach 2:
The patent directly applies mechanical vibration to the laser beam delivery mechanism or optical elements, causing the laser focal point to vibrate at high frequency. This vibration distributes the thermal energy across a larger volume over time, preventing heat accumulation and optical damage while maintaining cutting efficiency.
3Power
If blade dicing is used to cut the substrate, then cutting capability is improved, but chipping occurs in the surface or back of the substrate resulting in performance degradation
Solution Approach 1:
The patent replaces the mechanical blade dicing system with a laser-based cutting system. This substitution eliminates the mechanical contact that causes chipping, using instead a non-contact laser beam that can be dynamically controlled through vibration to achieve clean cuts without mechanical damage to the chip surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the quality and yield of semiconductor processing by preventing heat-induced deformation and chipping, achieving higher processing accuracy and efficiency compared to traditional methods.
Implementation Method 1
a laser beam outputter configured to cause a laser beam to travel in a direction of processing to process a semiconductor
Implementation Method 2
a condenser lens configured to form a laser spot on the semiconductor, the laser spot traveling in the direction of processing
Implementation Method 3
to vibrate the laser beam at a constant amplitude in a direction of vibration different from the direction of processing, thereby improving the performance of chips
Data Source
AI summary
A laser beam irradiation device for processing a semiconductor includes a laser beam outputter configured to cause a laser beam to travel in a direction of processing to process a semiconductor, and to vibrate the laser beam at a constant amplitude in a direction of vibration different from the direction of processing; and a condenser lens configured to form a laser spot on the semiconductor, the laser spot traveling in the direction of processing and vibrating in the direction of vibration.