Vibrating Element Pad Connection Structure for Lower Wiring Resistance
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Solution Overview
Problem
In existing vibrating devices, the presence of multiple wires between the vibrating piece and the pad increases wiring resistance, affecting vibration characteristics.
Innovation Solution
A vibrating device configuration that includes a base with a semiconductor substrate, a circuit element, an insulating layer, and a pad electrode, where an opening exposes the pad electrode's front surface, and a first metal pattern and a metal member electrically connect the pad electrode to the vibrating element, reducing the need for multiple wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple wires are disposed between the vibrating piece and the pad, then electrical connection is established, but wiring resistance increases and vibration characteristics are affected
Solution Approach 1:
The patent merges multiple separate wire connections into a single integrated pad electrode structure. The pad electrode directly contacts the vibrating piece and establishes electrical connection through a single continuous conductive path, eliminating the need for multiple discrete wires and their associated connection points, thereby reducing wiring resistance and improving vibration characteristics
Solution Approach 2:
The patent extracts and eliminates the intermediate wire structures from the electrical connection path. By removing the multiple wires and their connections, the design achieves direct electrical contact between the pad electrode and the vibrating piece, reducing the harmful effect of wiring resistance on vibration characteristics
2Reliability
If multiple wires are used for electrical connection, then electrical connectivity is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple wire functions into a single pad electrode structure. The pad electrode serves as both the electrical connection element and the structural component, eliminating the need for separate wire elements and reducing overall device complexity while maintaining reliable electrical connectivity
Solution Approach 2:
The pad electrode performs multiple functions simultaneously: it provides electrical connection, serves as a structural support element, and acts as a bonding interface. This multi-functionality eliminates the need for separate dedicated wire components, thereby reducing device complexity
Data Source
AI summary
A vibrating device includes a base 10 including a semiconductor substrate 11 having a first surface 11a and a second surface 11b, a circuit element being formed on the first surface 11a, an insulating layer 12 disposed on a first surface 11a side, and a pad electrode 14a disposed between a third surface 10a on a side of the insulating layer 12 opposite from the semiconductor substrate 11 and the first surface 11a and electrically connected to the circuit element, an opening portion 16 that exposes a front surface 14a1 of the pad electrode 14a being formed in the insulating layer 12 at a position overlapping the pad electrode 14a in plan view; a first metal pattern 30A disposed on at least a part of the front surface 14a1; a vibrating element 40 electrically connected to the first metal pattern 30A; and a metal member 18 disposed on the first metal pattern 30A overlapping the front surface 14al in plan view, and electrically connecting the first metal pattern 30A and the vibrating element 40.