Vibration Apparatus Direct Cable Connection Eliminates Soldering
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Solution Overview
Problem
The manufacturing process of vibration apparatuses is complex and costly due to the need for soldering, leading to increased thickness and potential detachment from signal cables, which complicates design and increases defects such as cracks.
Innovation Solution
A vibration apparatus with a simplified structure and manufacturing process, featuring a vibration generating part with cover members and signal lines connected between them, eliminating the need for soldering and reducing thickness, weight, and preventing defects like cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering process is used to connect pad electrode with signal cable, then electrical connection is achieved, but manufacturing process becomes complicated and manufacturing cost rises
Solution Approach 1:
The patent extracts and eliminates the soldering process from the manufacturing workflow by implementing direct mechanical contact between the signal cable and pad electrode. The signal cable is directly inserted into and contacts the pad electrode without requiring soldering, thereby removing the harmful soldering step while maintaining electrical connection functionality.
Solution Approach 2:
The pad electrode serves as an intermediary element that enables direct electrical connection between the signal cable and the piezoelectric device. By designing the pad electrode with a structure that receives and contacts the signal cable directly, the patent creates a mediator that facilitates electrical connection without requiring soldering or additional bonding processes.
2Reliability
If soldering process is used to connect pad electrode with signal cable, then electrical connection is achieved, but thickness of product increases
Solution Approach 1:
The patent removes the additional thickness caused by soldering joints and bonding materials by implementing direct contact connection. The signal cable is inserted directly into the pad electrode structure, eliminating the need for solder layers and bonding adhesives that would increase the overall thickness of the vibration apparatus.
3Reliability
If soldering process is used to connect pad electrode with signal cable, then electrical connection is achieved, but vibration apparatus may detach from signal cable
Solution Approach 1:
The pad electrode is designed as a mediator structure that mechanically receives and secures the signal cable through direct contact. The signal cable is inserted into the pad electrode, creating a stable mechanical and electrical connection that prevents detachment during vibration operation, eliminating the reliability issues associated with soldering joint detachment.
4Reliability
If soldering process is used for various components, then electrical connections are achieved, but manufacturing cost rises
Solution Approach 1:
The patent extracts and eliminates the costly soldering process from the manufacturing workflow by implementing direct mechanical contact connections. This removal of the soldering step directly reduces manufacturing costs while maintaining electrical connection functionality through the simplified direct-contact structure.
5Reliability
If soldering process is used, then electrical connection is achieved, but defects such as cracks increase
Solution Approach 1:
The patent removes the harmful soldering process that causes thermal stress and cracking. By implementing direct mechanical contact between the signal cable and pad electrode, the patent eliminates the high-temperature soldering step that generates thermal shock and leads to cracks in the piezoelectric device and surrounding structures, thereby reducing defect rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the manufacturing process, reduces thickness and weight, enhances sound pressure level characteristics, and improves yield by preventing defects, thus optimizing the manufacturing process and maintaining acoustic quality.
Implementation Method 1
piezoelectric devices capable of being implemented with a thin thickness are attracting much attention instead of voice coils
Data Source
AI summary
A vibration apparatus may include a vibration generating part including at least one or more vibration parts. The vibration apparatus may further include a first cover member at a first surface of the vibration generating part, a second cover member at a second surface of the vibration generating part, and a signal cable including first and second signal lines connected to the at least one or more vibration parts. The second surface of the vibration generating part is different from the first surface of the vibration generating part. The first and second signal lines may be provided between the second cover member and the vibration generating part.