Vibration Curing Device for Epoxy Adhesive Specimens
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Solution Overview
Problem
Existing methods for preparing tensile specimens of epoxy structural adhesives for composite pressure vessels fail to effectively address the challenges of ultra-low temperature environments, particularly in terms of achieving sufficient strength and stiffness.
Innovation Solution
A vibration curing device and method that involves mixing an epoxy resin, amine-curing agent, and silane coupling agent, followed by vacuum drying and vibration curing to eliminate bubbles and enhance adhesive properties, resulting in a tensile specimen suitable for ultra-low temperature conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional vacuum degassing process is used to prepare tensile specimens, then bubbles can be removed, but the mechanical properties (tensile strength and stiffness) are insufficient for ultra-low temperature environments
Solution Approach 1:
The patent applies mechanical vibration during the curing process of the epoxy structural adhesive. The vibration device generates vibrational energy that penetrates the adhesive material, effectively removing bubbles and voids while enhancing the mechanical properties. This vibration-assisted curing method produces tensile specimens with superior tensile strength and stiffness compared to traditional vacuum degassing, making the adhesive suitable for ultra-low temperature environments in composite pressure vessels.
2Strength
If vibration curing is applied to enhance adhesive properties, then tensile strength is improved, but the process complexity increases
Solution Approach 1:
The patent combines the vibration function and curing function into a single integrated device. The vibration curing device simultaneously performs vibration treatment and thermal curing of the epoxy structural adhesive, eliminating the need for separate vacuum degassing and curing equipment. This integration simplifies the overall process while achieving enhanced tensile strength and making the system more suitable for industrial application.
3Ease of manufacture
If the adhesive is cured without vibration treatment, then the process is simple, but the mechanical properties are insufficient for composite pressure vessel applications
Solution Approach 1:
The patent introduces mechanical vibration as a straightforward enhancement to the curing process. The vibration device is easily integrated into the existing curing setup, adding minimal operational complexity while dramatically improving the reliability of the adhesive in ultra-low temperature environments. The vibration treatment effectively removes bubbles and enhances bonding, making the adhesive suitable for critical applications like composite pressure vessels with simple procedural additions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively produces tensile specimens with improved mechanical properties, such as increased tensile strength, which are comparable to those obtained using traditional vacuum degassing processes, thereby ensuring reliability in ultra-low temperature environments.
Implementation Method 1
a vibration function of the vibration device is turned on to vibrate the whole mold
Implementation Method 2
a heating function of the vibration device is turned on to raise a temperature to 60° C. at a heating rate of 1° C./min, and then keep warm for 480 minutes
Implementation Method 3
mixing an epoxy resin, amine-curing agent, and silane coupling agent
Data Source
AI summary
The present disclosure discloses a method for preparing a tensile specimen and a vibration curing device. The method includes obtaining a colloid mixture and putting it into a beaker and using a stirring device to stir the colloid mixture mixed evenly. The method further includes putting the colloid mixture into a vacuum dryer, and spraying a release agent on cleaned tensile specimen mold, and using a needle to inject the colloid mixture into a molding groove of the tensile specimen mold and filling the molding groove, fixing the pressing plate and the tensile specimen mold together to form a whole mold, fixing it on a vibration platform of a vibration device, turning on the vibration device to vibrate the whole mold and to heat the whole mold to a predetermined temperature, cooling the whole mold, and demolding the whole mold to obtain the tensile specimen of the structural adhesive.