Vibration-Damped Circuit Arrangement Using Segmented Wiring Carrier

Solution Overview

Problem

Highly integrated electronic structures face challenges in mechanical stability under vibrating loads, often requiring complex stabilization structures that increase costs and restrict design freedom, particularly in applications like power converters and aviation systems.

Innovation Solution

Incorporating vibration-damping separating elements into wiring carrier boards, which can be flexible or semi-flexible and geometrically shaped, to decouple or dampen vibration transmission between sections, using materials with varying modulus of elasticity and incorporating viscoelastic or viscous materials like plastic or rubber.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If complex additional stabilization structures are used to stabilize extensive elements under mechanical loading, then mechanical stability is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:

Improvemechanical stabilityVSAvoidstructural complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The circuit board is divided into multiple sections by separating elements that create vibration decoupling. This segmentation allows each section to be stabilized independently, reducing the need for complex global stabilization structures while maintaining overall mechanical stability under vibrating loads.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Vibration decoupling is implemented locally at specific separating elements between sections rather than applying complex stabilization structures throughout the entire circuit board. This localized approach reduces device complexity while providing targeted mechanical stability where vibrations occur.

Inventive Principle:

Principle #3Local quality

2Stability of the object's composition

If complex additional stabilization structures are used to stabilize elements, then mechanical stability is improved, but manufacturing cost increases

Engineering Contradiction:

Improvemechanical stabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The circuit board is divided into multiple sections by separating elements that create vibration decoupling. This segmentation allows each section to be stabilized independently, reducing the need for complex global stabilization structures while maintaining overall mechanical stability under vibrating loads.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Vibration decoupling is implemented locally at specific separating elements between sections rather than applying complex stabilization structures throughout the entire circuit board. This localized approach reduces device complexity while providing targeted mechanical stability where vibrations occur.

Inventive Principle:

Principle #3Local quality

3Device complexity

If restrictions on functional integration are accepted to simplify construction, then device complexity is reduced, but functionality and efficiency decrease

Engineering Contradiction:

Improvestructural complexityVSAvoidfunctional integration

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The separating elements serve multiple functions: they provide electrical separation between high-voltage and low-voltage circuits, creates vibration decoupling between sections, and maintain mechanical support. This multi-functionality allows full functional integration without requiring additional complex stabilization structures.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The circuit board is divided into multiple sections by separating elements that create vibration decoupling. This segmentation allows each section to be stabilized independently, reducing the need for complex global stabilization structures while maintaining overall mechanical stability under vibrating loads.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces vibration transmission between sections of the wiring carrier board, enhancing mechanical stability while minimizing additional structural complexity and cost, suitable for use in power converters and aviation systems.

Implementation Method 1

the separating element may be configured as a locally limited lamination of highly viscoelastic or highly viscous materials into the wiring carrier board

Methodology Applied

Scientific EffectViscoelastic damping: Viscoelasticity

Implementation Method 2

The transmission of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element

Methodology Applied

Scientific EffectVibration damping: Damping

Implementation Method 3

the separating element may be configured as a flexible or semi-flexible region of the wiring carrier board

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS11564310B2Vibration-damped circuit arrangement, converter, and aircraft having such an arrangement

Publication Date: 2023.01.24 ROLLS ROYCE DEUT LTD & CO KG

AI summary

The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).