Vibration Detection Element With Intermediary Support
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Solution Overview
Problem
Conventional vibration detection elements with oscillators thinner than 10 µm face deflection issues and damage during manufacturing due to mechanical polishing or etching processes, preventing them from vibrating effectively.
Innovation Solution
A vibration detection element design featuring substrates with recesses and support members that hold the oscillator in place without direct contact with the bottom surfaces, using anodic bonding and heat-resistant adhesives to secure the oscillator within a space portion, allowing it to vibrate without damage, and a manufacturing method that includes precise etching and adhesive removal to maintain oscillator integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the oscillator thickness is reduced to less than 10 μm to improve detection sensitivity, then the detection sensitivity is improved, but the oscillator deflects and contacts the cover members preventing vibration
Solution Approach 1:
The patent introduces a support member as an intermediary element between the oscillator and the bottom surface of the recess. This support member prevents the oscillator from contacting the cover members during vibration while providing necessary mechanical support. The support member acts as a mediator that resolves the conflict between enabling thin oscillator design for high sensitivity and preventing deflection-induced contact that would stop vibration.
Solution Approach 2:
The patent creates a three-dimensional recess structure with the oscillator positioned within it, rather than placing the oscillator on a flat surface. By forming a recess with specific depth and width dimensions, the structure provides vertical clearance that prevents contact between the oscillating oscillator and the cover members, enabling thin oscillators to vibrate freely without mechanical interference.
2Manufacturing precision
If mechanical polishing or etching is used to form the oscillator to improve manufacturing precision, then the oscillator size and thickness can be controlled, but the thin oscillator may be damaged during the process
Solution Approach 1:
The support member is formed in advance within the recess structure before the oscillator is placed and processed. This preliminary formation of the support structure allows subsequent oscillator processing to proceed without risk of damage, as the support member is already in position to protect the oscillator during and after manufacturing operations.
Solution Approach 2:
The support member serves as a protective cushion that prevents direct contact between the fragile thin oscillator and the rigid cover members or processing tools. By having this protective element in place beforehand, the oscillator is shielded from mechanical damage during etching, polishing, and assembly operations.
3Device complexity
If the oscillator is placed in direct contact with the cover members defining the micro-space to simplify the structure, then the device complexity is reduced, but the oscillator cannot vibrate when thinner than 10 μm
Solution Approach 1:
The support member acts as a necessary intermediary that enables the oscillator to function properly within the micro-space defined by the cover members. Rather than having the oscillator contact the cover members directly, the support member provides the appropriate mechanical interface, allowing the oscillator to vibrate freely while maintaining structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables oscillators thinner than 10 µm to vibrate stably and prevents damage during manufacturing, enhancing detection sensitivity and maintaining the oscillator's integrity, with the ability to achieve a fundamental resonance frequency of at least 1 GHz and theoretical sensitivity up to 80,000 times that of existing quartz oscillators.
Implementation Method 1
an oscillator which is thinner than 10 μm and which vibrates in the space portion and contacts the first support member or the second support member
Implementation Method 2
using anodic bonding and heat-resistant adhesives to secure the oscillator within a space portion
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
A vibration detection element (10) includes substrates (1 to 3), a support member (22), a support member (32), and an oscillator (4) . The substrates (1 to 3) have a space portion (SP) having a bottom surface (21A) and a bottom surface (31A) opposed to the bottom surface (21A). The support member (22) protrudes from the bottom surface (21A) toward the bottom surface (31A) of the space portion (SP). The support member (32) protrudes from the bottom surface (31A) toward the bottom surface (21A) of the space portion. The oscillator (4) is disposed in contact with the support member (22) or the support member (32) and capable of vibrating in the space portion (SP) and has a thickness less than 10 µm. The support members (22, 32) each include multiple supports which prevent the oscillator (4) from contacting the bottom surface (21A) or the bottom surface (31A).