Vibration Device Wire Bonding Stress Reduction
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Solution Overview
Problem
Existing vibration devices face damage due to stress from bonding wires coupled to external electrodes, particularly when using fragile substrates like silicon or glass, which can lead to packaging issues and reduced reliability.
Innovation Solution
The vibration device design incorporates external coupling terminals with wire coupling areas positioned within the bonding area between substrates, allowing for efficient ultrasonic bonding without creating gaps, thus minimizing stress on the package and enhancing bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are coupled to external electrodes at positions overlapping the accommodation space, then electrical connection is achieved, but the package is damaged by stress from wire coupling
Solution Approach 1:
The patent repositions the wire coupling area from the traditional location (overlapping the accommodation space) to a new location (within the bonding area between substrates). This spatial repositioning in a different dimension eliminates the harmful stress on the package while maintaining electrical connectivity, as the wire coupling now occurs within the reinforced bonding region rather than over the vulnerable accommodation space.
2Strength
If external coupling terminals are positioned outside the bonding area, then electrical connection is established, but gaps are created reducing bonding strength
Solution Approach 1:
The patent merges the function of external coupling terminals with the bonding area structure. The terminals are integrated within the bonding area between substrates, combining the electrical connection function with the mechanical bonding function. This eliminates gaps that would reduce bonding strength, as the terminals are now part of the bonded region rather than creating discontinuities in the bonding interface.
3Reliability
If traditional wire coupling positions are used, then electrical connection is achieved, but package damage occurs due to stress concentration
Solution Approach 1:
The bonding area between substrates serves as an intermediary structure that supports the wire coupling. Instead of wires directly coupling to external electrodes over the accommodation space (which causes stress concentration), the wire coupling is mediated through the bonding area, which distributes and absorbs the mechanical stress, thereby protecting the package while maintaining electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the likelihood of package damage during wire coupling, stabilizes electrical properties, and enables miniaturization of the vibration module while maintaining high reliability, even with fragile substrates.
Implementation Method 1
allowing for efficient ultrasonic bonding without creating gaps
Data Source
AI summary
A vibration device includes a first substrate including a first surface and a second surface opposite to the first surface; a second substrate including a third surface bonded to the second surface thereby forming an accommodation space between the first substrate and the second substrate, and a fourth surface opposite to the third surface; a vibration element accommodated in the accommodation space; and a first external coupling terminal arranged at the fourth surface and having a first position to where a first wire to be coupled. The first position being within an area overlapping a bonding area between the first substrate and the second substrate, as viewed in a plan view.