Vibration Device Through Electrode Noise Isolation
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Solution Overview
Problem
Integrated circuit structures face noise transmission issues between circuit blocks via redistribution lines, particularly affecting analog circuits like oscillation circuits, leading to increased phase noise.
Innovation Solution
A vibration device with strategically designed through electrodes and power supply interconnections, where the electric resistance of the through electrodes is higher than the interconnection resistance, effectively isolating noise between circuit blocks, using polysilicon for through electrodes and metal for interconnections to maintain high resistance ratios.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through silicon via holes are used to electrically couple circuit blocks, then electrical connection is achieved, but noise is transmitted between circuit blocks via the redistribution line
Solution Approach 1:
The power supply network is segmented into multiple independent paths by providing multiple through electrodes (first through electrode, second through electrode, third through electrode) that penetrate the substrate. Each through electrode forms a separate electrical connection path between the power supply terminal and different circuit blocks, preventing noise from propagating along a single shared path.
Solution Approach 2:
The patent introduces an intermediary resistance element (fourth resistance element) in the power supply interconnection that acts as a noise barrier. This resistance element is strategically positioned to have higher resistance than the through electrodes, thereby blocking noise transmission while allowing power supply current to pass through to the circuit blocks.
2Power
If multiple through electrodes are used in parallel to supply power, then power distribution is improved, but noise transmission paths increase
Solution Approach 1:
Each through electrode is assigned a different local function: the first through electrode supplies power to the first circuit block, the second through electrode supplies power to the second circuit block, and the third through electrode supplies power to the third circuit block. This local differentiation of functions prevents noise from one circuit block from affecting others through shared power paths.
Solution Approach 2:
The patent employs composite material structure by combining through electrodes made of highly conductive materials (such as copper or aluminum) with the substrate material (such as silicon or ceramic). This composite structure optimizes both electrical conductivity for power supply and noise isolation properties of the substrate material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly suppresses phase noise in analog circuits, enhancing frequency accuracy and stability of oscillation circuits by preventing noise transmission, resulting in improved frequency resolution and reduced thermal stress.
Implementation Method 1
R1>R4 and R2>R4, in which R1 is an electric resistance of the first through electrode, R2 is an electric resistance of the second through electrode, and R4 is an electric resistance of a zone of the power supply interconnection coupling the first through electrode and the second through electrode to each other
Data Source
AI summary
A vibration device includes a substrate having a first surface and a second surface at an opposite side to the first surface, a vibration element disposed on the first surface, a first through electrode which penetrates the substrate, and is configured to electrically couple the power supply interconnection disposed on the second surface and the first circuit block disposed on the first surface, and a second through electrode which penetrates the substrate, and is configured to electrically couple the power supply interconnection and the second circuit block including an analog circuit disposed on the first circuit, wherein R1>R4 and R2>R4, in which R1 is an electric resistance of the first through electrode, R2 is an electric resistance of the second through electrode, and R4 is an electric resistance of a zone of the power supply interconnection coupling the first through electrode and the second through electrode.