Vibration Element Etching Layout for Stable Resonance Frequency
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Solution Overview
Problem
Existing methods for manufacturing vibration devices result in increased variation in resonance frequency due to the removal of silicon oxide films used for correcting resonance frequency, as they also remove the films around the vibrating portion.
Innovation Solution
A method involving the formation of a protective film resistant to etchants, with specific opening portions, is used to etch the support substrate and form a space between the element and the substrate, while preserving the silicon oxide films for resonance correction, thereby minimizing resonance frequency variation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wet etching is performed to remove the silicon oxide film on the electrode pad, then the electrode pad surface is exposed, but the silicon oxide film around the vibrating portion is also removed, resulting in increased variation in resonance frequency
Solution Approach 1:
The patent divides the opening in the protective film into two distinct parts: a first opening that exposes only the electrode pad surface, and a second opening that exposes the silicon oxide film around the vibrating portion. This segmentation allows selective etching of different regions, enabling the electrode pad to be exposed while preserving the resonance correction film.
Solution Approach 2:
The protective film is designed with different opening characteristics in different locations: the first opening is positioned to expose only the electrode pad area, while the second opening is positioned to expose the silicon oxide film around the vibrating portion. This local differentiation enables selective access to different functional regions during the etching process.
2Ease of operation
If the silicon oxide film around the vibrating portion is removed to expose the electrode pad, then the electrode pad becomes accessible, but the resonance frequency correction capability is lost
Solution Approach 1:
The patent segments the opening structure into two separate openings: the first opening provides accessibility to the electrode pad for electrical connections, while the second opening preserves the silicon oxide film for resonance frequency correction. This segmentation resolves the conflict between accessibility and functional integrity.
Solution Approach 2:
The protective film acts as an intermediary structure that selectively controls access to different regions. By incorporating two不同类型的 openings in this intermediary layer, the patent enables simultaneous achievement of electrode pad accessibility and resonance film preservation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces variation in resonance frequency by protecting the silicon oxide films and ensuring precise etching, resulting in a stable and accurate resonance frequency for the vibration elements.
Implementation Method 1
forming a space between the element and the support substrate by etching the support substrate with the etchant passing through the first opening portion
Data Source
AI summary
A method for manufacturing a device including an active layer and a support substrate bonded to the active layer on one surface side, the active layer including an element, an electrode configured to drive the element, a frame portion disposed around the element, and an electrode pad disposed in the frame portion and coupled to the electrode, the method including: forming a protective film at the other surface side of the frame portion and the other surface side of the element, the protective film being resistant to an etchant and including a first opening portion formed between an outer shape of the element and the frame portion and a second opening portion formed on the electrode pad; and forming a space between the element and the support substrate by etching the support substrate with the etchant passing through the first opening portion.