Vibration Isolation Device for Electronic Components
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Solution Overview
Problem
Existing vibration isolation methods for electronic components in heavy machinery and consumer devices are inadequate, as they either require large and heavy support systems, are ineffective in harsh environments, or fail to isolate vibrations from multiple directions and orientations, leading to potential damage from low-frequency, high-amplitude vibrations and unpredictable conditions.
Innovation Solution
A vibration isolation device comprising an isolated member housed within a support frame, suspended by elastic members that apply forces with vectors at least 90° apart, providing damping to absorb and dissipate vibrational energy, and a retention device for selective pre-tensioning to maintain stability and prevent resonance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical, hydraulic, or pneumatic systems are used to decouple electronic components from vibration transmission paths, then vibration isolation is improved, but the system complexity and susceptibility to damage increase
Solution Approach 1:
The patent replaces complex mechanical, hydraulic, or pneumatic decoupling systems with a simpler elastic member-based suspension system. The elastic members (springs, elastomers, or rubber elements) directly suspend the electronics housing from the support frame, eliminating the need for complex mechanical linkages, hydraulic cylinders, or pneumatic actuators. This substitution maintains vibration isolation effectiveness while dramatically reducing system complexity and susceptibility to damage.
Solution Approach 2:
The patent changes the fundamental parameter of vibration isolation from active mechanical control to passive elastic deformation. By using elastic members with appropriate stiffness characteristics, the system transforms high-frequency vibrations into elastic deformations that are absorbed rather than transmitted. This parameter change simplifies the system while maintaining isolation effectiveness across a broad frequency range.
2Reliability
If electronics are removed from the vibration source and placed on the ground, then vibration isolation is improved, but the device size and operational feasibility increase
Solution Approach 1:
The patent implements a nested configuration where the electronics housing is suspended within the support frame structure. The elastic members connect the electronics housing to the support frame, creating a nested arrangement that isolates the electronics from vibrations while maintaining a compact, integrated form factor. This eliminates the need to remove electronics from the machinery and place them on the ground, preserving operational feasibility while achieving vibration isolation.
3Reliability
If soft and highly compliant mounts are used to isolate heavy electronics, then vibration isolation is improved, but the system weight and cost increase
Solution Approach 1:
The patent employs composite material strategies by combining elastic members with damping materials or using multi-layer elastic structures. This composite approach provides both the compliance needed for vibration isolation and the structural support required for heavy electronics, eliminating the need for excessively soft mounts that would require additional heavy reinforcement. The composite structure achieves effective isolation while maintaining reasonable weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively isolates electronic components from a wide range of vibrations, reducing peak particle velocities and dominant frequencies, thereby protecting the components from damage and ensuring reliable operation across various conditions and orientations.
Implementation Method 1
suspended by elastic members that apply forces with vectors at least 90° apart
Implementation Method 2
providing damping to absorb and dissipate vibrational energy
Data Source
AI summary
Implementations of the present invention relate to devices, systems, and methods for isolating electronic components from input vibrations. The vibration isolation device may passively isolate the housed electronics from substantially all input vibrations. The vibration isolation device may include elastic members to suspend the electronic components within a support frame such that input vibrations are unable to directly influence the electronic components.


