Vibration-Resistant Electronic Component Assembly with Stress-Free Wire Fixing
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Solution Overview
Problem
Electronic components, particularly electrolytic capacitors, face reduced vibration resistance due to mechanical prestresses at electrical contact points, leading to potential failure under dynamic loads, and existing encapsulation methods increase production costs and may not account for gas production during operation.
Innovation Solution
An electronic component arrangement featuring a fixing device with recesses for connecting wires, allowing them to be guided and fixed without mechanical prestressing, using a carrier plate and contact forks that are orthogonal to the component body, and a fixing compound to secure the wires in a stress-free state, reducing production costs and enhancing vibration resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connecting wire is firmly clamped and welded to the contact fork, then electrical contact is ensured, but mechanical prestress is introduced into the connecting wire
Solution Approach 1:
The patent divides the electrical connection system into separate functional segments: the contact fork remains rigid for reliable electrical contact, while the connecting wire is allowed to remain flexible and stress-free through the guiding device with recesses. This segmentation allows each component to optimize its function without imposing mechanical stress on the other.
Solution Approach 2:
The guiding device with recesses acts as an intermediary element between the rigid contact fork and the flexible connecting wire. It provides a transition zone that allows the wire to be guided and positioned without being mechanically stressed, while still ensuring reliable electrical contact at the contact fork.
2Reliability
If the component is encapsulated in casting compound or adhesive, then vibration resistance is improved, but production costs increase
Solution Approach 1:
The patent extracts the vibration protection function from the traditional encapsulation approach (casting compound or adhesive) and implements it through a structural design featuring the guiding device with recesses. This allows the component to achieve vibration resistance through its own geometry and assembly structure, eliminating the need for additional expensive encapsulation materials and processes.
Solution Approach 2:
The patent replaces expensive encapsulation materials (casting compounds, adhesives) with a simple structural solution using the guiding device and recesses. This structural approach provides equivalent or superior vibration protection without the ongoing costs associated with material consumption, curing processes, and quality control of encapsulation materials.
3Reliability
If the component is completely encapsulated, then vibration resistance is improved, but gas escape is prevented causing overpressure
Solution Approach 1:
The patent applies local quality by providing targeted protection only where needed - the guiding device with recesses protects the connecting wire and electrical contact area from vibration stress, while leaving the component body and gas venting paths completely open. This localized approach achieves vibration resistance without preventing gas escape, avoiding the overpressure problem that would result from complete encapsulation.
Data Source
Figure 1~2
Figure 3
AI summary
The invention relates to an electronic component assembly (10) comprising an electronic component (12) having a component body (14) and at least one connection wire (32) which projects from one side (23) of the component body (14). The electronic component assembly (10) also comprises a contact fork (36) for electrically contacting the connection wire (32) to a carrier plate (16). In particular, the electronic component assembly (10) is characterised in that it comprises a fixing device (38) for fixing the connection wire (32), said fixing device being arranged between the contact fork (36) and the component body (14), and being secured to the carrier plate (16) by a first end (40). A second end (42) of the fixing device (38) projects from the carrier plate (16), wherein a recess (44) is arranged at the second end (42), in which the connection wire (32) is received and fixed securely in position. In this way, it can be advantageously ensured that the connection wire (32) can be held inside the component (12) without static mechanical tension, thereby permitting a vibration resistance of the component (12) to be increased overall.