Vibration Sensor Conduction Cavity Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional vibration sensors have complex structures and high manufacturing costs due to multiple bonding positions between circuit boards and the need for punching on the circuit board to accommodate chip modules, leading to low product reliability and lengthy manufacturing processes.
Innovation Solution
A vibration sensor design that includes a circuit board assembly, a shell covering the assembly to form an installation space, a vibration pick-up assembly, and a chip assembly connected via a support shell to form a conduction cavity, eliminating the need for direct bonding between the chip and circuit board, thus simplifying the structure and reducing processing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple circuit boards are enclosed to form an internal space with chip modules, then the vibration sensor can perform vibration detection and signal processing, but the number of bonding positions increases leading to low product reliability
Solution Approach 1:
The patent integrates the chip module directly onto the circuit board assembly, merging previously separate components (chip module and circuit board) into a unified structure. This eliminates multiple bonding positions between separate circuit boards and reduces the number of connection points, thereby improving reliability while reducing structural complexity.
2Ease of manufacture
If punching is performed on the circuit board to allow chip module communication, then the chip module can communicate with the installation space, but the manufacturing process becomes lengthy and costs increase
Solution Approach 1:
The patent extracts the need for punching operations by redesigning the circuit board assembly to have pre-formed communication channels or openings that allow the chip module to communicate with the installation space without requiring post-assembly punching. This eliminates a time-consuming manufacturing step while maintaining ease of manufacture.
3Productivity
If punching is performed on the circuit board to accommodate chip modules, then the chip module can be installed, but the structure becomes complex and product yield decreases
Solution Approach 1:
The patent applies preliminary action by pre-configuring the circuit board assembly with appropriate mounting structures, communication channels, and connection points before the chip module is installed. This eliminates the need for punching operations during assembly, simplifies the structure, and improves product yield by reducing manufacturing complexity and potential damage to components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances structural reliability, reduces manufacturing costs, and simplifies the installation process by minimizing exposed bonding positions and eliminating the need for punching on the circuit board, resulting in a more stable and cost-effective vibration sensor.
Implementation Method 1
The bone voiceprint sensor is a sensor that uses the diaphragm vibration to instigate air flow, then excites the MEMS diaphragm, and detects the flow signal
Implementation Method 2
a micro-electromechanical system (MEMS) element connected to a side of the support shell away from the vibration pick-up assembly
Data Source
AI summary
Disclosed are a vibration sensor and an electronic equipment. The vibration sensor includes a circuit board assembly, a shell, a vibration pick-up assembly, a support shell and a chip assembly. The shell is configured to cover a side of the circuit board assembly to form an installation space. The vibration pick-up assembly is provided in the installation space, and is configured to pick up an external bone vibration and generate a response vibration. The support shell is connected to a side of the vibration pick-up assembly away from the circuit board assembly. The chip assembly is connected to a side of the support shell away from the circuit board assembly, and is electrically connected to the circuit board assembly. The vibration pick-up assembly, the support shell and the chip assembly are enclosed to form a conduction cavity.