Vibration Sensor Electrode Overlap for Thin Impact Resistance
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Solution Overview
Problem
Existing electronic components, such as gyro sensors, require a significant gap between the semiconductor substrate and the sensor element to absorb external impacts, leading to increased thickness and size due to the need for flexible lead wires, which limits their miniaturization and productivity.
Innovation Solution
The design includes a semiconductor element with a vibration element and electrodes, where the second electrode is positioned inside the outer contour of the vibration element, allowing for a smaller semiconductor element and improved connectivity through flexible wiring boards, enabling reduced size and enhanced productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a gap is provided between the semiconductor substrate and the sensor element to absorb external impacts, then the reliability is improved, but the thickness of the sensor device increases
Solution Approach 1:
The patent applies this principle by using a flexible lead wire that can bend to absorb external impacts, replacing the need for a thick gap structure. The lead wire's flexibility allows it to deform under impact forces while maintaining electrical connection, thus protecting the sensor element without increasing device thickness.
Solution Approach 2:
The patent resolves the contradiction by transitioning from a vertical dimension solution (providing a gap in the thickness direction) to a horizontal dimension solution (arranging the sensor element to overlap the semiconductor substrate in plan view). This allows impact absorption through lead wire bending in the horizontal plane while maintaining minimal thickness.
2Reliability
If a gap exceeding the bending amount of the lead wire is provided between the semiconductor substrate and the sensor element, then the reliability is improved, but the thickness of the sensor device increases
Solution Approach 1:
The patent arranges the sensor element to overlap the semiconductor substrate in plan view, utilizing the horizontal dimension for lead wire bending and impact absorption. This eliminates the need for vertical gap space, thereby maintaining thin device profile while ensuring adequate protection against external impacts.
Solution Approach 2:
The flexible lead wire serves as the shock-absorbing element, capable of bending to accommodate external impacts. By positioning the sensor element to overlap the substrate, the lead wire has sufficient horizontal space to bend and absorb impact energy without requiring increased vertical thickness.
3Productivity
If the second electrode is positioned inside the outer contour of the vibration element, then the productivity is improved, but the connectivity may be compromised
Solution Approach 1:
The patent utilizes the vertical dimension (thickness direction) for electrical connectivity between the second electrode and the wiring board, while the horizontal dimension (plan view) is optimized for compact electrode placement within the vibration element contour. This dimensional separation allows both high productivity and reliable connectivity.
Solution Approach 2:
The flexible wiring board enables reliable electrical connection from the second electrode positioned within the vibration element contour. The wiring board's flexibility allows it to extend connections to appropriate locations without requiring the electrode to be positioned outside the vibration element boundary, thus maintaining both compactness and connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a smaller electronic component size, improved connectivity, and increased productivity by eliminating unnecessary regions on the semiconductor element, while also reducing the risk of vibration element breakage during handling.
Implementation Method 1
a sensor device including a sensor element and a function of driving the sensor element is widely known as an electronic component including a piezoelectric element
Data Source
AI summary
An electronic component includes: a semiconductor element including a circuit; a vibration element; a first electrode arranged on a first surface of the semiconductor element and connected to the circuit and the vibration element arranged on the first surface side; a second electrode arranged on the first surface; a first wiring board including a first wire connected to the second electrode; and a second wiring board including a second wire to which the first wire is connected. At least a part of an inner side region of an outer contour of the vibration element is arranged to overlap the second electrode in plan view facing the first surface.