Vibration Sensor On-Chip Signal Analysis Reduces Transmission Time
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Solution Overview
Problem
Current vibration sensors are inefficient in real-time analysis and data transmission, often requiring external monitoring machines for frequency spectrum transform and signal analysis, leading to data loss and increased transmission time, which hinders their application in smart machinery and manufacturing industries.
Innovation Solution
A vibration sensor with an integrated application-specific integrated circuit chip that includes a sampling module, transform module, and analysis module, capable of converting and analyzing vibration signals directly on the sensor, reducing analysis time and enhancing efficiency by performing real-time frequency-domain data analysis and adjusting detection bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If vibration sensors use external monitoring machines for frequency spectrum transform and signal analysis, then device complexity is reduced, but data transmission time increases and data loss occurs
Solution Approach 1:
The patent merges the frequency spectrum transform and signal analysis functions directly into the vibration sensor chip by integrating an application-specific integrated circuit (ASIC) chip. This integration combines the sensing element and processing unit into a single device, eliminating the need for external monitoring machines and reducing data transmission time while preventing data loss.
Solution Approach 2:
The patent introduces an intermediary processing layer (the ASIC chip with sampling, transform, and analysis modules) between the vibration sensor and external systems. This intermediary performs real-time signal processing locally, acting as a mediator that reduces the need for external processing and minimizes data transmission requirements.
2Productivity
If vibration sensors perform real-time frequency-domain data analysis, then analysis speed improves, but device complexity increases
Solution Approach 1:
The patent changes the operational parameters of the sensor by implementing dedicated hardware modules for sampling, frequency transform, and signal analysis. These modules operate with optimized parameters (sampling rate, transform size, analysis algorithms) that enable real-time processing while managing device complexity through specialized circuit design.
Solution Approach 2:
The patent segments the signal processing function into distinct modular components: a sampling module for acquiring vibration signals, a transform module for frequency spectrum analysis, and an analysis module for interpreting results. This segmentation allows each module to be optimized independently while working together to achieve real-time analysis.
3Loss of information
If vibration sensors integrate processing functions, then data transmission efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The patent implements a universal integrated circuit design that performs multiple functions (sampling, frequency transform, signal analysis) within a single ASIC chip. This multi-functional approach improves data transmission efficiency by processing signals locally while managing manufacturing complexity through standardized integrated circuit fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient real-time monitoring with reduced data transmission time and loss, allowing for comprehensive analysis and miniaturization of the vibration sensor, thus meeting the requirements of smart machinery and manufacturing industries.
Implementation Method 1
a microelectromechanical vibration sensor chip disposed on the substrate and detecting a vibration applied to an object to generate a plurality of vibration signals
Data Source
AI summary
A vibration sensor with monitoring function is provided, which includes a substrate, a microelectromechanical vibration sensor chip and an application-specific integrated circuit chip. The microelectromechanical vibration sensor chip is disposed on the substrate and detects a vibration applied to an object to generate a plurality of vibration signals. The application-specific integrated circuit chip is disposed on the substrate and electrically connected to the microelectromechanical vibration sensor chip, which includes a sampling module, a transform module and an analysis module. The sampling module receives and converts the vibration signals into a plurality of digital signals, and filters the digital signals to generate a plurality of time-domain data. The transform module transforms the time-domain data into a frequency-domain data according to a predetermined number. The analysis module executes a comparison process to compare the frequency-domain data with a predetermined spectrum feature table and generates a notification signal according to the comparison result.