Vibration Sensor Through-Hole Cavity Design
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Solution Overview
Problem
Existing vibration sensors with hollow structures in the circuit board increase thickness, expose bonding positions, and complicate structures, leading to reduced reliability and increased manufacturing costs.
Innovation Solution
A vibration sensor design featuring a circuit board assembly with a back cavity, a housing with a vent hole, a chip assembly, a vibration-pickup assembly, and a through-hole that communicates between the back cavity and a second cavity, optimizing signal strength and sensitivity without increasing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a hollow structure is provided inside the circuit board to enlarge the back cavity space, then the sensing performance is improved, but the thickness of the circuit board increases
Solution Approach 1:
The patent transitions from a horizontal hollow structure (planar dimension) to a vertical through-hole structure (depth dimension). The through-hole extends vertically through the circuit board thickness, allowing the back cavity to access additional volume in the vertical dimension without increasing the horizontal footprint or surface area, thus resolving the contradiction between cavity volume and board thickness.
Solution Approach 2:
The through-hole structure nests within the existing circuit board thickness, utilizing the vertical space already occupied by the board's layered structure. This allows the back cavity to expand into the vertical dimension without requiring additional external space, effectively nesting the cavity expansion within the board's existing geometric envelope.
2Volume of moving object
If a hollow structure is provided inside the circuit board, then the back cavity space is enlarged, but multiple bonding positions are exposed reducing reliability
Solution Approach 1:
The patent extracts the cavity expansion function from the planar hollow structure and relocates it to a vertical through-hole configuration. This extraction eliminates the need for multiple exposed bonding positions on the board surface, as the through-hole access point can be sealed or positioned where it does not compromise bonding integrity, thereby maintaining reliability while achieving cavity volume expansion.
3Volume of moving object
If a hollow structure is provided inside the circuit board, then the back cavity space is enlarged, but the structure becomes complex with redundant manufacturing processes
Solution Approach 1:
The patent extracts the cavity formation function from complex multi-step hollow structure manufacturing and simplifies it to a single through-hole drilling operation. This extraction reduces the manufacturing process to essential steps only, eliminating redundant processes while achieving the same cavity volume expansion, thereby reducing structural complexity and manufacturing burden.
4Volume of moving object
If a hollow structure is provided inside the circuit board, then the back cavity space is enlarged, but manufacturing costs increase and product yield decreases
Solution Approach 1:
The patent extracts the cavity expansion requirement and implements it through a simple through-hole structure that can be manufactured using standard drilling and sealing processes. This extraction eliminates the need for complex hollow structure fabrication, reducing manufacturing complexity, lowering costs, and improving product yield by reducing defects associated with complex assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances signal strength, output, signal-to-noise ratio, and sensitivity of the vibration sensor, while reducing the overall height and simplifying the structure, thereby improving reliability and reducing manufacturing costs.
Implementation Method 1
a vibration-pickup assembly (4) provided inside the cavity (5, 6) and dividing the cavity (5, 6) into a first cavity (5), which is proximate to the chip assembly (3), and a second cavity (6), which is proximate to the housing (2)
Implementation Method 2
a through-hole (7) configured to be in communication with the back cavity (11) and the second cavity (6)
Data Source
AI summary
Disclosed are a vibration sensor, an electronic device and a vibration detection method. The vibration sensor comprises a circuit board assembly, a housing, a chip assembly, a vibration-pickup assembly and a through-hole. A back cavity is formed inside the circuit board assembly, the housing is mounted over the circuit board assembly, and the chip assembly is provided on a side of the circuit board assembly proximate to the housing and is electrically connected to the circuit board assembly. The vibration-pickup assembly is provided inside the cavity and dividing the cavity into a first cavity and a second cavity. The through-hole of the vibration sensor may be in communication with the back cavity and the second cavity.