Vibration Suppression Mechanism for Electronic Devices
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Solution Overview
Problem
Existing vibration suppression structures for electronic devices in information processing systems, such as HDDs and ODDs, are inefficient in absorbing vibrational energy, leading to potential device failure due to self-induced vibrations and require excessive material for effective shock absorption.
Innovation Solution
A vibration suppression mechanism that incorporates a holding unit with vibration absorbing members on one surface and contact members protruding from the opposite surface, which are held by the vibration absorbing members to effectively absorb vibrations by being sandwiched between the electronic device and the housing, allowing for efficient energy absorption and reduced material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vibration absorbing members (rubber, sponge, gel) are used between the electronic device and housing, then shock absorption is provided, but vibrational energy is not efficiently absorbed and the device may fail due to self-induced vibrations
Solution Approach 1:
The patent changes the material parameter from conventional rubber/sponge/gel to vibration absorbing material with specific damping characteristics. This material converts vibrational energy to thermal energy through internal friction, efficiently absorbing self-induced vibrations from the electronic device and preventing operational failures.
Solution Approach 2:
The patent uses a composite structure combining vibration absorbing material with a holding member. The vibration absorbing material is integrated into the holding member to form a composite component that provides both mechanical support and vibration damping functions, improving energy absorption efficiency.
2Reliability
If conventional shock absorbing structures are used in holding members, then shock absorption is achieved, but excessive amount of material is required
Solution Approach 1:
The patent applies vibration absorbing material locally at the contacting portion of the holding member where vibrations are most intense. This localized application provides effective shock absorption while minimizing the total material quantity required, avoiding the need to fill the entire holding member with damping material.
Solution Approach 2:
The patent segments the holding member structure by separating the vibration absorption function from the mechanical support function. The vibration absorbing member is positioned at the contacting portion to handle shock absorption, while the rest of the holding member maintains structural integrity with minimal material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces vibrations affecting electronic device operation, enhances vibration absorption, and minimizes material usage, thereby improving the reliability and efficiency of vibration suppression in information processing systems.
Implementation Method 1
Such vibration absorbing members absorb and suppress vibrations by converting vibrational energy into thermal energy or the like. Further, such vibration absorbing members also have the conventional function of suppressing transmission of oscillatory waves. The energy conversion is realized using friction between elements in the member or the like.
Data Source
AI summary
Provided is a vibration suppression mechanism for an electronic device, which efficiently absorbs vibrations that adversely affect operation of the electronic device. The vibration suppression mechanism for the electronic device includes a holding unit that is constructed such that a vibration absorbing member is used at a contacting portion on a first surface of a holding member and a contact member protruding from a second surface of the holding member which is opposite to the first surface is held by the vibration absorbing member, the holding unit supporting the electronic device via the vibration absorbing member used at the contacting portion on the first surface or the contact member protruding from the second surface, and a housing for holding the holding unit in a mounted state under a state in which the contact member protruding from the second surface or the vibration absorbing member used at the contacting portion on the first surface abuts against a holding structure.