Vibration Transmission Unit for Uniform Adhesive Dissolution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for releasing semiconductor wafers from supporting plates are inefficient due to the slow permeation of dissolving liquids through adhesives, leading to prolonged processing times and difficulties in uniformly dissolving the adhesive, which hampers production efficiency and wafer handling.
Innovation Solution
A treatment liquid permeation unit incorporating a vibration unit and a vibration transmission unit is used to accelerate the permeation of dissolving liquids through adhesives, enhancing the transmission of vibrations to ensure faster and more uniform dissolution of the adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dissolving liquid is supplied to adhesive from supporting plate side via through hole, then adhesive can be dissolved, but permeation time is long and dissolution is non-uniform
Solution Approach 1:
The patent applies ultrasonic vibration to the supporting plate, which transmits vibration to the adhesive layer. This mechanical vibration accelerates the permeation of dissolving liquid through the adhesive and promotes uniform dissolution by preventing localized stagnation and enhancing liquid distribution throughout the adhesive layer.
Solution Approach 2:
The patent replaces the conventional passive diffusion-based dissolution process with an active vibration-assisted process. By substituting the natural slow permeation mechanism with vibration-driven liquid movement, the system achieves both faster and more uniform adhesive dissolution.
2Volume of moving object
If wafer thickness is reduced to 25-150 μm for high integration, then chip size is reduced, but wafer strength decreases causing cracks and warpage
Solution Approach 1:
The patent changes the physical state and mechanical properties of the supporting plate through ultrasonic vibration. The vibration temporarily alters the mechanical interaction between the supporting plate and wafer, providing enhanced support during critical operations like adhesive dissolution and wafer release, thereby preventing cracks and warpage in thin wafers.
3Strength
If manual handling is used for thin wafers to prevent damage, then wafer strength is maintained, but operation complexity increases
Solution Approach 1:
The patent enables the supporting plate-wafer-adhesive system to self-release through vibration-assisted adhesive dissolution. The ultrasonic vibration automatically promotes uniform adhesive breakdown and facilitates clean separation without requiring manual intervention, making the process both gentle for thin wafers and operationally simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time required to dissolve the adhesive, allowing for quicker wafer release and improved handling, while also facilitating efficient cleaning of the wafer surface.
Implementation Method 1
at least one vibration unit; and a vibration transmission unit provided between the adhesive and the vibration unit so as to transmit a vibration from the vibration unit to the adhesive
Data Source
AI summary
A treatment liquid permeation unit comprises: at least one vibration unit; and a vibration transmission unit for transmitting a vibration from the vibration unit. The vibration transmission unit is positioned between an adhesive with which a wafer is combined to a supporting plate or an adhesive adhered to a surface of the wafer and the vibration unit. A vibration from the vibration unit is transmitted via the vibration transmission unit. This promotes the treatment liquid for dissolving the adhesive to permeate the adhesive to which the treatment liquid is supplied. Therefore, the treatment liquid can more uniformly permeate the adhesive in a shorter time. This allows the treatment liquid for dissolving the adhesive to permeate the adhesive with which the wafer is combined to the supporting plate or to permeate the adhesive adhered to the surface of the wafer in a shorter time.