Vibrational Cooling Element for Mobile Device Heat Dissipation

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Solution Overview

Problem

Current cooling solutions for mobile devices, such as smartphones and laptops, are inadequate in managing heat generated by high-performance processors, leading to throttling and reduced performance due to insufficient heat dissipation, especially when used with mobile device cases that restrict airflow.

Innovation Solution

An active cooling system integrated into a mobile device case using a centrally anchored or edge-anchored cooling element that utilizes vibrational motion to direct fluid towards the device's surface for efficient heat dissipation, with a thickness of up to three millimeters and a depth of up to two millimeters, driven at resonant frequencies to enhance airflow and reduce power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If active cooling devices such as fans are used to drive air through computing devices, then heat dissipation is improved, but device size and complexity increase

Engineering Contradiction:

Improveheat dissipationVSAvoidcooling system complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent employs a vibrational cooling element that oscillates at resonant frequencies to drive air flow through the device. This mechanical vibration approach replaces traditional rotating fans, achieving effective heat dissipation while reducing moving parts and system complexity. The vibrational mechanism creates pressure differentials that propel air through heat-generating components without requiring complex rotational assemblies.

Inventive Principle:

Principle #18Mechanical vibration

Solution Approach 2:

The invention substitutes the traditional mechanical fan system with a vibrational field-based cooling mechanism. By using resonant frequency vibrations to drive air flow, the system replaces complex rotational mechanics with simpler oscillatory motion, reducing the number of moving parts while maintaining effective heat dissipation performance.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Length of moving object

If cooling system thickness is reduced to maintain slim profile, then device portability is improved, but cooling effectiveness deteriorates

Engineering Contradiction:

Improvecase thicknessVSAvoidcooling effectiveness

Core Design Contradiction:

Length of moving objectVSTemperature

Solution Approach 1:

The vibrational cooling element operates at resonant frequencies to amplify air flow within the constrained thin profile. By exploiting resonance, the system achieves effective cooling performance in a compact space, as the vibrational energy efficiently drives air through the heat-generating components despite the limited thickness of the case.

Inventive Principle:

Principle #18Mechanical vibration

Solution Approach 2:

The patent changes the operational parameters by utilizing resonant frequency vibration instead of traditional continuous air flow. This parameter change allows the cooling system to achieve maximum effectiveness within a reduced thickness, as the resonant vibrations create sufficient pressure differentials to drive air flow through the compact cooling channels.

Inventive Principle:

Principle #35Parameter changes

3Use of energy by moving object

If power consumption is reduced for low power usage, then battery life is improved, but cooling performance deteriorates

Engineering Contradiction:

Improvepower consumptionVSAvoidcooling performance

Core Design Contradiction:

Use of energy by moving objectVSTemperature

Solution Approach 1:

The vibrational cooling element utilizes resonant frequency oscillation to minimize power consumption. By operating at resonance, the system achieves efficient air flow with reduced energy input, as the resonant condition amplifies the cooling effect while requiring minimal power to sustain the vibrational motion.

Inventive Principle:

Principle #18Mechanical vibration

Solution Approach 2:

The cooling system employs periodic vibrational action at resonant frequencies rather than continuous high-power operation. This periodic activation at optimized intervals and frequencies maintains effective cooling performance while significantly reducing overall power consumption compared to traditional continuous fan operation.

Inventive Principle:

Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The active cooling system effectively dissipates heat from mobile devices, allowing processors to operate at higher speeds for longer periods without throttling, improving performance and reducing noise, while maintaining a slim profile and low power usage.

Implementation Method 1

The active cooling system utilizes vibrational motion to direct fluid towards the device's surface for efficient heat dissipation

Methodology Applied

Scientific EffectVibrational motion: Vibration

Implementation Method 2

driven at resonant frequencies to enhance airflow and reduce power consumption

Methodology Applied

Scientific EffectResonant frequencies: Resonance

Implementation Method 3

The active cooling system effectively dissipates heat from mobile devices, allowing processors to operate at higher speeds for longer periods without throttling

Methodology Applied

Scientific EffectHeat dissipation: Convection

Data Source

PatentUS11533823B2Mobile device case including an active cooling system

Publication Date: 2022.12.20 FRORE SYSTEMS INC

AI summary

A mobile device case is described. The mobile device case includes a housing configured to retain a mobile device and an active cooling system integrated into the housing. The active cooling system configured to use vibrational motion to cool a surface of the mobile device.