Vibrator Device Stress Management via IC Layout
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Solution Overview
Problem
Existing vibrator devices face challenges due to stress generated during packaging, which affects the characteristics of integrated circuits due to differences in thermal expansion coefficients between materials, leading to deformation and instability in oscillation frequencies.
Innovation Solution
The design includes a semiconductor substrate with an integrated circuit and a vibrating element, where the integrated circuit is positioned to overlap with the joining portion of the lid, minimizing the impact of stress-induced deformation by strategically placing passive and active elements to stabilize the circuit components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the integrated circuit is packaged with a lid and base, then the device is protected and sealed, but stress is generated due to thermal expansion coefficient differences causing deformation of the integrated circuit
Solution Approach 1:
The patent applies preliminary action by strategically positioning passive elements and circuit components before packaging to anticipate and counteract the stress deformation that will occur during thermal cycling. The layout is designed in advance to compensate for the expected deformation caused by thermal expansion coefficient differences between the lid, base, and integrated circuit materials.
Solution Approach 2:
The patent applies local quality by creating different structural characteristics in different regions of the package. Specifically, the joining portion where the lid connects to the base is designed with specific structural features that differ from other regions, allowing this area to accommodate stress differently and protect the integrated circuit from deformation in critical areas.
2Stability of the object's composition
If passive elements are positioned away from the joining portion, then stress impact is reduced, but circuit layout flexibility is limited
Solution Approach 1:
The patent applies local quality by designating specific regions with different functional characteristics. The joining portion is identified as a high-stress region, and passive elements are strategically placed in low-stress regions away from the joining portion. This creates localized zones with different stress characteristics, allowing the circuit layout to optimize both stability and flexibility by placing different components in appropriately characterized regions.
3Manufacturing precision
If the integrated circuit layout is designed to compensate for stress, then deformation is reduced, but design time and complexity increase
Solution Approach 1:
The patent applies preliminary action by performing stress analysis and layout optimization during the design phase, before manufacturing. The integrated circuit layout is pre-configured to compensate for expected stress deformation, allowing the actual manufacturing process to proceed with standard precision while achieving the compensation effect through intelligent design rather than complex manufacturing adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the deformation of passive and active elements, thereby stabilizing the oscillation characteristics and maintaining consistent frequency performance despite thermal stress, enhancing the overall reliability and accuracy of the vibrator device.
Implementation Method 1
a lid joined to the base at a joining portion of the base so as to accommodate the vibrating element
Implementation Method 2
the passive element is disposed such that at least a part of the passive element overlaps with the joining portion in a plan view from a direction orthogonal to the first surface
Data Source
AI summary
A vibrator device includes a semiconductor substrate, a base, a vibrating element, and a lid. The semiconductor substrate has a first surface and a second surface which is in a front-back relationship with the first surface. The base includes an integrated circuit disposed on a first surface or a second surface. The vibrating element is electrically coupled to the integrated circuit and is disposed on the first surface side. The lid is joined to the base at a joining portion of the base to accommodate the vibrating element. The integrated circuit includes a passive element, and the passive element is disposed such that at least a part of the passive element overlaps with the joining portion in a plan view from a direction orthogonal to the first surface.