Piezoelectric Vibrator Dry Etching Mask Width Control
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Solution Overview
Problem
The existing methods for manufacturing small-sized piezoelectric vibrator devices face complications in processing, as they require different steps for forming grooves and exteriors using dry and wet etching methods, leading to increased processing complexity and steps.
Innovation Solution
A dry etching method is employed to form both notches and concave portions by using an etching mask with specific width configurations, where the first mask portion forms a maximum width between side surfaces and the second mask portion forms a minimum width of the opening, allowing for simultaneous formation of penetration and non-penetration portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dry etching method is used to form a bottomed groove in the vibration unit, then the exterior can be formed with good precision, but it becomes difficult to simultaneously form both the penetration portion and the non-penetration groove portion
Solution Approach 1:
The patent applies local quality by creating different mask opening widths in different regions. The mask has a first opening with a first width for the groove region and a second opening with a second width for the exterior region, where the widths are deliberately made different. This causes the etching rate to vary locally across the substrate, allowing the groove to be formed to a specific depth without penetrating through, while the exterior is etched differently, all in a single dry etching process.
2Manufacturing precision
If a wet etching method is used to form the groove, then the groove can be formed as a non-penetration portion, but the processing steps become complicated and the number of steps increases
Solution Approach 1:
The patent merges multiple functions into a single dry etching process. By designing the mask with different opening widths for different regions, the process combines groove formation (non-penetration) and exterior formation into one step. This eliminates the need for separate wet etching steps that would otherwise be required to create the bottomed groove structure, thereby reducing overall process complexity while maintaining precise depth control.
Solution Approach 2:
The patent utilizes parameter changes by varying the mask opening width to control the etching rate. The first opening width is set to be smaller than the second opening width, which directly affects the etching rate in different regions. This parameter variation allows selective etching depth control without changing the etching method itself, enabling precise groove formation as a non-penetration portion while simplifying the overall process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the processing steps, reduces the number of processes, and enables the formation of stable, small-sized vibrator devices with improved stiffness and vibration characteristics.
Implementation Method 1
performing the dry etching processing on the substrate and forming the concave portion together with the notch
Data Source
AI summary
An electronic component manufacturing method, in which a notch and a concave portion are formed in a substrate, includes forming an etching mask in which a maximum width of a first mask portion which forms a width between two side surfaces of the concave portion along a longitudinal direction, when the substrate is seen in a plan view from a direction perpendicular to a surface of the substrate having the concave portion formed therein, is smaller than a width of a second mask portion which forms a minimum width of an opening of the notch, and forming the notch and the concave portion by performing dry etching processing on the substrate.