Vibrator Package Bonding Structure for Low-Height Stable Connections

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Solution Overview

Problem

Existing COL package structures face challenges in achieving a low height due to the presence of wires connecting the control chip and MEMS chip, which also lead to unstable electrical connections over time.

Innovation Solution

A vibrator device configuration that electrically connects the circuit element and vibrator using conductive connecting members instead of wires, allowing for a low-profile design while maintaining stable connections, and includes a circuit element with a redisposing wiring layer for flexible pad disposition and a mold portion for protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If wires are used to electrically connect the control chip and MEMS chip, then electrical connection is achieved, but the height of the package structure increases

Engineering Contradiction:

Improveheight of package structureVSAvoidstability of electrical connection

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The patent removes the wires from the package structure entirely, extracting the harmful element that caused height increase. Electrical connection is achieved through direct bonding between pads on the control chip and MEMS chip, eliminating the need for wire interconnections and thus reducing package height while maintaining reliable electrical connection.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the electrical connection function directly into the bonding interface between the control chip and MEMS chip. By integrating the connection pads and bonding structure, the patent eliminates the separate wire interconnection layer, achieving both low height and stable electrical connection through structural integration.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If wires are used to connect the control chip and MEMS chip, then electrical connection is established, but the connection becomes unstable over time

Engineering Contradiction:

Improvestability of electrical connectionVSAvoidheight of package structure

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The patent replaces the mechanical wire connection system with a direct solid-state bonding system. By using pad-to-pad bonding between the control chip and MEMS chip, the patent eliminates the mechanical wire interconnection that was prone to instability, achieving more reliable electrical connection while reducing package height.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If the second connection pad is disposed to overlap the vibrator, then electrical connection is achieved, but wire connection becomes difficult

Engineering Contradiction:

Improveease of wire connectionVSAvoiddisposition of connection pads

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent resolves the spatial conflict by transitioning from a two-dimensional overlapping arrangement to a three-dimensional stacked arrangement. The connection pads are disposed on different vertical levels (z-dimension), with the second connection pad on the circuit element and the vibrator pad on the vibrator, allowing wire connection without planar overlap while maintaining electrical connectivity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Object-affected harmful factors

If wires are used for electrical connection, then connection flexibility is achieved, but protection from environmental factors is reduced

Engineering Contradiction:

Improveprotection from moisture, dust, and shockVSAvoidstructure of connecting members

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges the electrical connection function with the structural bonding function by using the same bonding pads and bonding material for both purposes. This integration eliminates the need for separate wire interconnections that would be vulnerable to environmental factors, providing inherent protection while simplifying the overall structure.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables a low-height vibrator device with stable electrical connections, improved reliability, and ease of inspection, while protecting the components from moisture, dust, and shock.

Implementation Method 1

a conductive connecting member that is disposed between the circuit element and the vibrator, bonds the circuit element and the vibrator together, and electrically connects the first connection pad and the first terminal together

Methodology Applied

Scientific EffectConduction (electrical): Conduction (electrical)

Implementation Method 2

a mold portion that is disposed on the base and covers the vibrator and the circuit element

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS10850972B2Vibrator device, oscillator, electronic device, and vehicle

Publication Date: 2020.12.01 SEIKO EPSON CORP

AI summary

A vibrator device includes a base, a vibrator that includes a vibrator element and a vibrator element package, which accommodates the vibrator element and has a first terminal on a surface on a base side, a circuit element that is disposed between the base and the vibrator and has a first connection pad on a surface on a vibrator side, and a conductive connecting member that is disposed between the circuit element and the vibrator, bonds the circuit element and the vibrator together, and electrically connects the first connection pad and the first terminal together.