Piezoelectric Vibrator Substrate Layout to Reduce Warpage Stress
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Solution Overview
Problem
Existing piezoelectric devices face increased stress and warpage due to insulating layers on the inner and lower surfaces of the substrate, which can lead to deformation and instability in the vibrator element.
Innovation Solution
A vibrator device design featuring a semiconductor substrate with a base and lid configuration, where the insulating layers are divided into separate regions on the upper and lower surfaces to reduce film stress and internal stress, thereby minimizing warpage and enhancing the reliability of terminal insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If insulating layers are formed on the inner surface and lower surface of the substrate to suppress deformation, then substrate deformation is reduced, but film stress and internal stress increase causing warpage
Solution Approach 1:
The insulating layer is divided into a first insulating layer formed on the inner surface of the concave portion and a second insulating layer formed on the lower surface of the substrate. By segmenting the insulating layer into separate regions, the patent reduces the cumulative film stress that would occur if a single continuous insulating layer covered both surfaces, thereby suppressing warpage while maintaining substrate stability.
2Stability of the object's composition
If insulating layers are formed on both surfaces to suppress deformation, then substrate deformation is reduced, but internal stress increases
Solution Approach 1:
The insulating layer is divided into a first insulating layer formed on the inner surface of the concave portion and a second insulating layer formed on the lower surface of the substrate. By segmenting the insulating layer into separate regions, the patent reduces the cumulative internal stress that would occur if a single continuous insulating layer covered both surfaces, thereby suppressing warpage while maintaining substrate stability.
3Stability of the object's composition
If insulating layers are formed on both surfaces to suppress deformation, then substrate deformation is reduced, but warpage increases
Solution Approach 1:
The insulating layer is divided into a first insulating layer formed on the inner surface of the concave portion and a second insulating layer formed on the lower surface of the substrate. By segmenting the insulating layer into separate regions, the patent reduces the cumulative film stress that would occur if a single continuous insulating layer covered both surfaces, thereby suppressing warpage while maintaining substrate stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The division of insulating layers into separate regions effectively reduces film stress and internal stress in the substrate, resulting in improved warpage reduction and increased reliability of the vibrator device.
Implementation Method 1
a piezoelectric vibrator element attached to a bottom surface of the concave portion
Data Source
AI summary
A vibrator device includes a base, a vibrator element attached to the base, and a lid housing the vibrator element between the base and itself and bonded to the base. The base has a semiconductor substrate including a first surface bonded to the lid and a second surface in a front-back relationship with the first surface, a first insulating layer placed on the first surface, first, second internal terminals placed on the first insulating layer and electrically coupled to the vibrator element, a second insulating layer placed on the second surface, and first, second external terminals placed on the second insulating layer and electrically coupled to the first, second internal terminals. The second insulating layer has a first external terminal region in which the first external terminal is placed and a second external terminal region separated from the first external terminal region, in which the second external terminal is placed.