Vibrator Support Substrate Thin-Wall Layout for Thermal Stress Relief
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Solution Overview
Problem
The existing vibrator devices experience significant thermal stress due to differences in thermal expansion coefficients between the support substrate and the base, leading to separation of bonding members from the substrate or base, which degrades the vibration characteristics.
Innovation Solution
The vibrator device incorporates a support substrate with thin-wall portions between bonding members, which reduces thermal stress by deflecting or extending these portions, and uses electrically conductive bonding members to absorb stress, ensuring the bonding members remain attached.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If bonding members are used to fix the support substrate to the base, then the support substrate is securely attached to the base, but thermal stress causes separation of bonding members from the support substrate or base due to difference in thermal expansion coefficients
Solution Approach 1:
The patent introduces thin-wall portions in the support substrate that change the structural parameters of the substrate. These thin-wall portions allow the support substrate to flexibly deform under thermal stress, changing its rigidity parameter to accommodate differential thermal expansion between the support substrate and base, thereby preventing bonding member separation while maintaining bonding strength.
Solution Approach 2:
The support substrate is segmented into thin-wall portions and other portions with different thicknesses. This segmentation creates zones of varying rigidity within the substrate, allowing specific areas to deform under thermal stress while other areas maintain structural integrity, thus protecting the bonding members from stress-induced separation.
2Stability of the object's composition
If the support substrate is made rigid to maintain structural stability, then the support substrate provides stable support for the vibrator element, but thermal stress increases causing bonding members to separate
Solution Approach 1:
The support substrate exhibits local quality variations through the thin-wall portions, where specific local areas have reduced thickness and consequently reduced rigidity. This allows localized flexibility in regions prone to thermal stress while other portions of the substrate maintain their rigidity and structural stability, achieving a balance between overall stability and local stress accommodation.
Solution Approach 2:
The thin-wall portions introduce dynamic characteristics to the support substrate, enabling it to adapt its rigidity in response to thermal conditions. Under normal conditions, the substrate maintains structural stability, but under thermal stress, the thin-wall portions can deform dynamically to relieve stress, preventing bonding member separation while preserving overall structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents the degradation and fluctuation of vibration characteristics by minimizing thermal stress and maintaining the integrity of bonding between the support substrate and the base, enhancing the reliability of the device.
Implementation Method 1
a significant thermal stress occurs between the support substrate and the bonding members, and between the bonding members and the base in accordance with a temperature variation due to a difference in thermal expansion coefficient between the support substrate and the base
Implementation Method 2
the bonding members are separated from the support substrate or the base
Data Source
AI summary
A vibrator device includes a base, a vibrator element, a support substrate configured to support the vibrator element, and at least three bonding members which are arranged on the support substrate at a distance from each other, and which are configured to bond the support substrate and the base to each other, wherein the support substrate has a thin-wall portion, and the thin-wall portion is arranged between a pair of the bonding members adjacent to each other at a distance smaller than a distance between another pair of the bonding members adjacent to each other.