Video Wall Module Voltage Supply Segmentation
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Solution Overview
Problem
Existing video wall modules with multiplicity of light emitting chips face inefficiencies in voltage supply and electrical insulation, leading to suboptimal performance and compactness.
Innovation Solution
A video wall module design featuring image pixels composed of multiple light emitting chips connected to distinct power lines, with surface metallization and insulation layers to ensure precise voltage supply and electrical insulation, allowing for compact construction and efficient light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If multiple light emitting chips are arranged in image pixels with distinct power lines, then voltage supply efficiency and light generation are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The module divides the video wall into multiple image pixels, each containing discrete light emitting chips (red, green, blue) connected to distinct power lines. This segmentation allows independent voltage supply to each chip type, optimizing electrical characteristics for each color while maintaining overall system efficiency.
Solution Approach 2:
The patent transitions from planar circuit board routing to three-dimensional vertical stacking, where light emitting chips are arranged in layers above the carrier. Power lines extend vertically through insulation layers to reach each chip, enabling compact high-density arrangements without increasing lateral footprint.
2Reliability
If surface metallization with contact sections is used for power lines, then electrical connection reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The power lines are segmented into distinct contact sections, each dedicated to specific light emitting chips. This segmentation provides clear alignment targets during manufacturing, reducing positioning errors while ensuring reliable electrical connections between power lines and chip terminals.
Solution Approach 2:
The surface metallization layers with contact sections are pre-formed on the carrier before mounting light emitting chips. This preliminary preparation establishes precise electrical connection points in advance, guiding chip placement and reducing manufacturing complexity during assembly.
3Reliability
If insulation layers with openings are provided between contact sections, then electrical insulation is improved, but device complexity increases
Solution Approach 1:
The insulation structure is segmented into regions with openings positioned over contact sections. This segmentation provides electrical isolation between adjacent power lines while maintaining compact geometry, preventing short circuits without requiring extensive insulating materials.
Solution Approach 2:
The insulation layer is integrated within the multi-layer structure, with openings nested through the insulation to expose contact sections. This nested arrangement combines insulation functionality with the overall module geometry, achieving electrical isolation without adding external complexity.
4Volume of moving object
If light emitting chips are arranged in openings above contact sections, then compact construction is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The module structure is segmented into discrete openings in the insulation layer, each positioned over a contact section. This segmentation creates defined mounting locations for light emitting chips, simplifying alignment and placement during manufacturing while achieving compact three-dimensional arrangement.
Solution Approach 2:
The openings in the insulation layer are pre-formed at precise positions corresponding to contact sections before chip mounting. This preliminary preparation establishes accurate registration points, guiding light emitting chip placement and reducing positioning errors during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves efficient voltage supply to light emitting chips, enabling optimal light generation and improved electrical insulation, resulting in a compact and reliable video wall solution.
Implementation Method 1
an image pixel is formed by at least one first and one second light emitting chip
Data Source
AI summary
A module for a video wall includes a first light emitting chip of an image pixel connecting to a first power line by a first electrical terminal, the first light emitting chip connects to a third power line by a second electrical terminal, a second light emitting chip of the image pixel connects to a second power line by the first electrical terminal, the second light emitting chip of the image pixel connects to a fourth power line by the second electrical terminal, the first and/or the second power line are/is a surface metallization, including contact sections, a light emitting chip is arranged on a contact section, at least between contact sections of a first and of a second power line an insulation layer is provided on a carrier, the insulation layer includes openings above the contact sections, and the light emitting chips are arranged in the openings.