Vinyl PPE Resin Composition for Low-Loss, Heat-Resistant PCB Insulators
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Solution Overview
Problem
Conventional copper-clad laminate materials face challenges in achieving low signal transmission loss, high thermal resistance, and maintaining flow properties while ensuring reliability in high-performance printed circuit boards.
Innovation Solution
A resin composition comprising a vinyl group-containing polyphenylene ether resin, a vinyl group-containing crosslinking agent, and a phosphorus-containing flame retardant, with specific ratios and structures, is used to create prepregs, laminates, and printed circuit boards with improved properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional copper-clad laminate materials are used to meet high-frequency and high-speed requirements, then signal transmission loss is reduced, but thermal resistance deteriorates
Solution Approach 1:
The patent uses a composite resin composition containing polyphenylene ether resin as the base polymer, combined with specific flame retardant additives and crosslinking agents. This composite material structure achieves both low dissipation factor (≤0.0042 at 10 GHz) and high thermal resistance (T288 ≥45 minutes) by synergistically combining materials with complementary properties.
Solution Approach 2:
The patent optimizes the chemical composition parameters of the resin system, specifically controlling the content of flame retardants (5-45 parts by weight per 100 parts resin) and using specific crosslinking agents to modify the polymer structure. These parameter changes enable the material to simultaneously achieve low signal loss and high thermal resistance.
2Temperature
If flame retardants are added to improve thermal resistance, then thermal resistance is improved, but dissipation factor increases
Solution Approach 1:
The patent introduces phosphorus-containing flame retardant compounds with specific molecular structures (Formula 1) that provide flame retardancy at molecular level without disrupting the polymer matrix's dielectric properties. The localized chemical structure design ensures flame retardant function is achieved while maintaining low dissipation factor.
Solution Approach 2:
The patent uses specific crosslinking agents as intermediaries between the flame retardant additives and the polyphenylene ether resin matrix. These crosslinking agents facilitate uniform distribution and bonding of flame retardants within the resin system, preventing aggregation that would otherwise increase dissipation factor while maintaining thermal resistance.
3Temperature
If crosslinking agents are used to improve thermal resistance, then thermal resistance is improved, but flow property deteriorates
Solution Approach 1:
The patent employs vinyl group-containing crosslinking agents that undergo controlled crosslinking reactions during the lamination process. The crosslinking occurs at the appropriate stage (during heating and pressing), allowing the resin to maintain good flow properties during impregnation before achieving the crosslinked network structure that provides high thermal resistance.
Solution Approach 2:
The patent creates a dynamic crosslinking system where the degree of crosslinking evolves during processing. Initially, the resin maintains fluidity for proper flow and impregnation, then progressively crosslinks during heating to achieve the final high thermal resistance state. This dynamic behavior resolves the contradiction between flowability and thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves low dissipation factor, high thermal resistance, and maintains resin flow during lamination, with no delamination after thermal resistance tests, enhancing the performance and reliability of printed circuit boards.
Implementation Method 1
the phosphorus-containing flame retardant has a structure of Formula (1)... no delamination occurs after subjecting the article to a thermal resistance test
Implementation Method 2
a resin composition comprising a vinyl group-containing polyphenylene ether resin, a vinyl group-containing crosslinking agent... comprising a prepreg, a resin film, a laminate, a printed circuit board or a cured insulator
Data Source
AI summary
A resin composition includes a vinyl group-containing polyphenylene ether resin, a vinyl group-containing crosslinking agent and a phosphorus-containing flame retardant, wherein a total amount of the vinyl group-containing polyphenylene ether resin and the vinyl group-containing crosslinking agent is 100 parts by weight, and an amount of the phosphorus-containing flame retardant is 5 parts by weight to 45 parts by weight; and the phosphorus-containing flame retardant has a structure of Formula (1). Moreover, also provided is an article made from the resin composition, including a prepreg, a resin film, a laminate, a printed circuit board or a cured insulator, and various properties can be improved including dissipation factor, inner resin flow, resin flow, flame retardancy, thermal resistance and thermal resistance after moisture absorption.