Vinylbenzyl Active Ester Resin for Low-Loss Heat-Resistant Substrates
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Solution Overview
Problem
Current thermosetting resin compositions for semiconductor package substrates face challenges in achieving both high heat resistance and low dielectric loss tangent while maintaining a low dielectric constant, especially when subjected to high-speed, high-frequency signals.
Innovation Solution
A monofunctional phenolic compound with vinylbenzyl groups is used to produce an active ester resin, which includes a vinylbenzyl-modified aryloxycarbonyl group, forming a cured product with enhanced dielectric properties and heat resistance when incorporated into a thermosetting resin composition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If an active ester compound is used as a curing agent for epoxy resins to achieve low dielectric constant and low dielectric loss tangent, then dielectric properties are improved, but heat resistance is insufficient
Solution Approach 1:
The invention modifies the chemical structure of the phenolic compound by introducing vinylbenzyl groups at specific positions (using compounds with formulas (1) or (2) where R1 is vinylbenzyl group and R2 is hydrogen, alkyl, or aryl group). This structural parameter change in the raw material leads to an active ester resin with both low dielectric loss tangent (3.0×10^-3 or less at 10 GHz) and high heat resistance (160°C or more), simultaneously improving both contradictory properties.
Solution Approach 2:
The invention creates a composite molecular structure by combining vinylbenzyl-modified phenolic compound with active ester groups. The resulting active ester resin integrates the low dielectric properties of traditional active ester compounds with the high heat resistance of vinylbenzyl-modified phenolic structures, achieving a material that satisfies both low dielectric loss tangent and high heat resistance requirements.
2Loss of energy
If multiple techniques are combined to achieve low dielectric constant and low dielectric loss tangent, then dielectric properties are improved, but device complexity increases
Solution Approach 1:
The invention merges multiple functional characteristics into a single active ester resin molecule. By incorporating vinylbenzyl groups into the phenolic compound structure before forming the active ester, the resin simultaneously achieves low dielectric constant, low dielectric loss tangent, and high heat resistance in one material system, eliminating the need for complex multi-component formulations.
Solution Approach 2:
The vinylbenzyl-modified active ester resin serves multiple functions simultaneously: it acts as both the resin base and the curing agent, provides low dielectric properties, maintains high heat resistance, and ensures reliable curing performance. This multi-functionality simplifies the overall composition compared to combining multiple separate techniques.
3Volume of moving object
If semiconductor package substrates are made thinner to reduce size, then compactness is improved, but warpage increases during packaging
Solution Approach 1:
The invention changes the thermal and mechanical parameters of the resin material through vinylbenzyl modification. The resulting active ester resin exhibits high heat resistance (160°C or more) and appropriate thermal expansion characteristics, enabling thin substrates to maintain dimensional stability and resist warpage during the packaging process while achieving the required thinness for compact designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting cured product exhibits improved heat resistance and dielectric properties, specifically a heat resistance of 160°C or more and a low dielectric loss tangent of 3.0×10−3 or less at 10 GHz, making it suitable for electronic components like semiconductor package substrates.
Implementation Method 1
A monofunctional phenolic compound including one or more vinylbenzyl groups, and a method for producing the active ester resin
Data Source
AI summary
Provided are a monofunctional phenolic compound used for producing an active ester resin capable of forming a cured product having excellent dielectric properties and excellent heat resistance, an active ester resin and a method for producing the active ester resin, and a thermosetting resin composition and a cured product of the thermosetting resin composition. Specifically, provided are a monofunctional phenolic compound including one or more vinylbenzyl groups and an active ester resin including a vinylbenzyl structure attached to a terminal group of the molecular chain and derived from the monofunctional phenolic compound. The vinylbenzyl structure preferably includes a vinylbenzyl-modified aryloxycarbonyl group.