Virtual Binocular Chip Pin Warpage Detection
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Solution Overview
Problem
Conventional chip pin detection methods face challenges with low precision due to field of view interference and the need for larger, less compact binocular vision devices, especially in semiconductor packaging where pin shape and warpage need to be accurately assessed.
Innovation Solution
A virtual binocular detection device with two imaging components arranged side by side and a light path deflection component using symmetrically distributed wedge-shaped prisms to achieve binocular vision, improving detection accuracy and field of view while maintaining a compact structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If two cameras are obliquely arranged to achieve binocular vision, then three-dimensional detection capability is improved, but device size increases and structure becomes less compact
Solution Approach 1:
The patent combines two camera systems into a single integrated detection device with a unified optical path. The first and second cameras share common structural components including the light source, imaging components, and processing system, thereby achieving binocular vision functionality while reducing overall device volume and improving structural compactness.
Solution Approach 2:
The patent introduces a light path deflection component that redirects light from the imaging components at oblique angles. This dimensional transformation of the optical path enables the cameras to capture three-dimensional information without requiring physical oblique arrangement of the camera sensors themselves, thus maintaining compact device geometry while achieving 3D detection capability.
2Device complexity
If a single camera simulates two virtual cameras to achieve binocular vision, then device complexity is reduced, but field of view decreases and detection accuracy for large objects is compromised
Solution Approach 1:
The patent divides the detection system into two independent camera subsystems (first camera and second camera), each with its own imaging component and optical path. This segmentation allows each camera to independently capture images from different angles, providing a comprehensive field of view while maintaining relatively simple individual camera designs that can be easily integrated.
3Device complexity
If 2D appearance detection is used to detect pin standing degree, then detection simplicity is maintained, but detection precision deteriorates due to field of view interference and material influence
Solution Approach 1:
The patent transitions from two-dimensional appearance detection to three-dimensional detection by incorporating the light path deflection component. This component redirects light to enable the cameras to capture pins from multiple angles and depths, creating a three-dimensional view that eliminates field of view interference and material-related detection artifacts, thereby significantly improving measurement precision while adding only moderate system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances detection precision and adaptability, allowing for accurate three-dimensional viewing of chip pins and warpage assessment, compatible with character and surface defect detection, and suitable for various chip sizes, with improved stability and integrity of the imaging system.
Implementation Method 1
a light path deflection component positioned between the light source and the imaging component and configured to receive and refract the light reflected by a surface of the to-be-detected object so as to make main light parallelly emit into the imaging component
Data Source
AI summary
The present invention discloses a virtual binocular detection device and a chip pin warpage detection method, and belongs to the technical field of chip detection. The virtual binocular detection device is configured to perform imaging detection on a to-be-detected object, and includes: a light source, two imaging components arranged side by side, and a light path deflection component positioned between the light source and the imaging component. The chip pin warpage detection method includes: establishing a binocular vision detection model; simultaneously collecting chip pin refraction imaging in an industrial lens by two vision cameras and sending the collected chip pin images to an industrial personal computer; and receiving and processing the chip pin images by the industrial personal computer to obtain a three-dimensional view of the chip pin, and determining whether the pin is warped. The present invention can accurately detect warpage of the chip pin.