Virtual Die Layout for Non-Volatile Memory Initialization and Wear Leveling

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Solution Overview

Problem

Non-volatile memory systems face challenges in achieving increased storage capacity within size constraints, with some die layouts being incompatible with existing initialization processes or addressing schemes, leading to degraded endurance due to incompatibility with storage management architectures.

Innovation Solution

A non-volatile memory system comprising multiple physically present memory dies configured in chip enable groups, with a controller that selects and initializes the dies using a die selection scheme, employing a virtual die layout to maintain address mapping, and implementing a wear leveling scheme based on capacity ratios to ensure compatible initialization and extended endurance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a die layout is chosen to increase storage capacity within size constraints, then storage capacity is improved, but compatibility with existing initialization processes or addressing schemes deteriorates

Engineering Contradiction:
Improvestorage capacityVSAvoidcompatibility with existing initialization processes
Core Design Contradiction:
Quantity of substanceVSAdaptability or versatility

Solution Approach 1:

The patent creates a virtual copy of the die layout that matches the expected configuration. The virtual die layout is a software representation that mimics the physical layout's characteristics while presenting a standardized interface to the controller, allowing existing initialization processes to work without modification

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The virtual die layout acts as an intermediary layer between the physical memory dies and the controller. It translates between the actual physical configuration and the expected logical configuration, enabling compatibility without requiring changes to either the physical layout or the controller software

Inventive Principle:
Principle #24Intermediary (Mediator)

2Quantity of substance

If a die layout is chosen to increase storage capacity, then storage capacity is improved, but compatibility with existing addressing schemes deteriorates

Engineering Contradiction:
Improvestorage capacityVSAvoidcompatibility with existing addressing schemes
Core Design Contradiction:
Quantity of substanceVSAdaptability or versatility

Solution Approach 1:

The virtual die layout creates a software copy of the address mapping that presents a standardized addressing scheme to the controller, even when the physical layout differs. This allows existing addressing schemes to function correctly without modification

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent introduces a virtual dimension layer that sits between the physical address space and the controller's address scheme. This virtual layer re-maps addresses to accommodate different physical layouts while maintaining compatibility with the controller's expected addressing format

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Quantity of substance

If a die layout is chosen to increase storage capacity, then storage capacity is improved, but endurance deteriorates due to incompatibility with storage management architectures

Engineering Contradiction:
Improvestorage capacityVSAvoidendurance
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The virtual die layout serves as a mediator that enables proper wear leveling by presenting a standardized view of the memory organization to the storage management architecture. This allows the controller to distribute write operations evenly across all physical dies, preventing any single die from experiencing excessive wear

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

By creating a virtual representation of the die layout, the system enables the storage management architecture to implement wear leveling algorithms correctly, even when the physical layout differs from expected configurations. The virtual copy allows proper tracking and management of write cycles across all physical dies

Inventive Principle:
Principle #26Copying

Data Source

PatentUS10073627B2Addressing, interleave, wear leveling, and initialization schemes for different chip enables and memory arrays of different types
Publication Date: 2018.09.11 SANDISK TECHNOLOGIES LLC
  • US10073627B2 patent drawing
  • US10073627B2 patent drawing
  • US10073627B2 patent drawing

AI summary

A non-volatile memory system may include a plurality of dies, where the plurality of dies are configured in a plurality of chip enable groups and at least one of the chip enable groups includes less than a maximum number of dies that may be uniquely identified according to a die selection scheme, where different memory arrays have different capacities and/or include memory elements of different types or technologies, or some combination thereof. One or more virtual die layouts, addressing schemes and mappings, wear leveling schemes, and initialization schemes may be employed for these multi-die configurations.