Virtual Metrology Model for Semiconductor Process Distribution Control
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Solution Overview
Problem
Variations in semiconductor wafer processing apparatus capabilities lead to inconsistent process distribution during semiconductor manufacturing, resulting in poor and inconsistent process results.
Innovation Solution
A method is introduced to control semiconductor process distribution by obtaining and analyzing process distribution data, deriving a virtual metrology model using statistical analysis, and modifying process variables to achieve consistent results, specifically using sensors and process controller variables in etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor processes are performed using conventional methods, then manufacturing productivity is maintained, but process distribution becomes inconsistent due to variations in apparatus capability
Solution Approach 1:
The patent implements feedback control by continuously monitoring process results and adjusting process variables based on deviations from target values. The system measures process distribution, compares it with reference values, and automatically modifies process parameters to maintain consistency, thereby improving reliability without requiring complex manual intervention
Solution Approach 2:
The patent changes process parameters dynamically based on measured process distribution. By adjusting process variables such as temperature, pressure, or material flow rates in response to detected deviations, the system maintains consistent process distribution across different apparatus conditions without increasing operational complexity
2Manufacturing precision
If process variables are adjusted to improve process distribution, then manufacturing precision improves, but measurement and control difficulty increases
Solution Approach 1:
The patent replaces complex manual measurement and adjustment procedures with automated sensing and control systems. Electronic sensors and computer-controlled adjustment mechanisms substitute for manual operations, reducing the difficulty of detecting and measuring process distribution while maintaining high manufacturing precision
Solution Approach 2:
The system performs self-measurement and self-adjustment of process variables. The apparatus automatically monitors its own process distribution and makes corrections without external intervention, simplifying the measurement and control process while achieving consistent results
Data Source
AI summary
A method of controlling process distribution of a semiconductor process includes receiving process distribution data representing the process distribution of the semiconductor process, receiving a parameter related to the process distribution, generating a virtual metrology model corresponding to the process distribution based on a relationship between the process distribution data and the parameter, and modifying a process variable affecting the process distribution based on the virtual metrology model.