Virtual Modules for Semiconductor Multi-Pass Process Control
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Solution Overview
Problem
In semiconductor wafer processing, existing systems face challenges in managing multi-pass processes and dynamic routing within multi-chamber tools, where physical modules are reused and perform different operations, leading to difficulties in associating recipes with physical modules and tracking wafer-specific data effectively.
Innovation Solution
The implementation of virtual modules within a semiconductor processing system allows for the creation and execution of static and dynamic virtual module plans, which include process sequences comprising physical and virtual module objects, enabling effective tracking and control of wafer-specific processes by associating desired results with specific module visits and non-visits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If physical modules are reused for multiple passes and different operations, then device versatility is improved, but data tracking and recipe association become more difficult
Solution Approach 1:
The patent segments the process control into physical modules (actual hardware) and virtual modules (software representations). Each virtual module represents a specific process step or operation, allowing multiple virtual modules to map to a single physical module when it performs different operations. This segmentation enables precise tracking of which virtual process step is being executed at any given time, resolving the data tracking difficulty while maintaining physical module versatility.
Solution Approach 2:
The patent introduces virtual modules as an intermediary layer between the factory control system and physical modules. This intermediary maintains the association between recipes and specific process steps even when physical modules are reused, by creating virtual representations that preserve the logical process flow and data integrity without requiring changes to the physical hardware architecture.
2Manufacturing precision
If factory control system cedes control to tool platform, then manufacturing precision is improved through tailored control, but system complexity increases
Solution Approach 1:
The patent segments control authority between the factory control system and tool platform controller. The factory system maintains oversight and sets process parameters, while the tool platform executes specific process steps through virtual modules. This segmentation allows tailored control at the process step level while maintaining overall system manageability through clear division of control responsibilities.
Solution Approach 2:
The virtual module system acts as an intermediary that enables the tool platform to execute factory-approved processes with precision. The virtual modules translate factory control decisions into specific physical module operations, allowing the tool platform to perform tailored control while the factory system maintains architectural oversight, thus managing complexity through layered control.
3Adaptability or versatility
If multiple passes through physical modules are allowed, then manufacturing flexibility is improved, but device complexity increases
Solution Approach 1:
The patent segments the process sequence into discrete virtual modules, where each virtual module represents a specific process step. When a physical module needs to be visited multiple times or skipped, the system simply activates or deactivates corresponding virtual modules in the sequence. This segmentation transforms complex multi-pass routing logic into simple virtual module activation decisions, reducing control system complexity while maintaining process flexibility.
Data Source
AI summary
The invention relates to controlling a semiconductor processing system. Among other things, the invention relates to a run-to-run controller to create virtual modules to control a multi-pass process performed by a multi-chamber tool during the processing of a semiconductor wafer.