Virtual Substrate 3D Measurement for Semiconductor Recipe Adjustment
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Solution Overview
Problem
Conventional systems lack the capability to perform three-dimensional measurements of virtual substrates, limiting the accuracy and efficiency in predicting the outcomes of semiconductor manufacturing processes and adjusting process recipes accordingly.
Innovation Solution
A method and system that allow users to define and output measurements of a three-dimensional measurement probe on a graphical user interface (GUI) for virtual substrates, enabling the measurement of features that cannot be measured in two dimensions, and allowing for more accurate predictions and adjustments to process recipes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional two-dimensional measurement methods are used for virtual substrates, then the system complexity remains low, but the measurement precision and manufacturing precision deteriorate because three-dimensional features cannot be accurately measured
Solution Approach 1:
The patent implements a three-dimensional measurement probe that extends beyond conventional two-dimensional measurement capabilities. The measurement probe includes depth or height measurement functionality, allowing virtual substrates with three-dimensional features to be accurately measured. This dimensional expansion enables precise measurement of features such as trench depths, via heights, and surface topography that cannot be captured in two dimensions, directly resolving the measurement precision limitation.
Solution Approach 2:
The patent creates a virtual substrate model that replicates the physical substrate's three-dimensional features. By measuring the virtual substrate instead of the physical one, the system obtains accurate three-dimensional measurements without requiring complex physical measurement equipment. The virtual model serves as a digital copy that preserves all geometric information, enabling precise measurement while avoiding the complexity of physical 3D measurement apparatus.
2Productivity
If three-dimensional measurement probes are implemented for virtual substrates, then the measurement precision and productivity improve, but the device complexity and ease of operation worsen due to the complexity of defining and using three-dimensional probes on a GUI
Solution Approach 1:
The measurement probe system includes automated functionality that reduces manual configuration requirements. The system can automatically identify features on the virtual substrate and suggest appropriate measurement probes, or automatically configure probe parameters based on the substrate geometry. This self-service capability eliminates the need for users to manually define complex three-dimensional probe settings, maintaining ease of operation while enabling advanced three-dimensional measurements that improve productivity.
Solution Approach 2:
The graphical user interface serves as an intermediary that simplifies the interaction between the user and the complex three-dimensional measurement probe system. The GUI provides intuitive visualization of the virtual substrate and measurement probes, allowing users to select and configure probes through graphical interactions rather than complex parameter inputs. This intermediary layer abstracts the complexity of three-dimensional probe definition while maintaining full measurement capabilities, resolving the contradiction between productivity improvement and ease of operation.
Data Source
AI summary
A method includes receiving feature data defining a plurality of features of a virtual substrate. The method further includes preparing the virtual substrate for display on a graphical user interface (GUI). The method further includes receiving one or more first inputs via the GUI. The one or more first inputs are associated with one or more locations of the virtual substrate. The method further includes defining a three-dimensional measurement probe based on the one or more first inputs. The method further includes outputting a measurement of the measurement probe. The measurement is associated with a characteristic of the virtual substrate measured by the three-dimensional measurement probe.