Viscoelastic Conductive Materials in Bond Lines for Stretchable Textiles
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Solution Overview
Problem
Conventional conductive materials embedded in textile articles break or weaken due to bending and stretching, leading to stiffness and discomfort, and cannot be easily integrated into bond lines without damaging the article.
Innovation Solution
Incorporating stretchable conductive materials with viscous or viscoelastic characteristics into bond lines using semi-cured adhesives and flexible deposition processes, allowing for flexible and durable electrically functional textiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive materials are embedded in textile articles, then electrical functionality is achieved, but the materials break or weaken due to bending and stretching
Solution Approach 1:
The patent changes the material parameters by using viscoelastic conductive materials instead of conventional rigid conductive materials. This parameter change allows the conductive material to deform with the textile during bending and stretching, preventing breakage while maintaining electrical functionality.
Solution Approach 2:
The patent creates a composite structure by bonding the viscoelastic conductive material into the bond line between textile layers using semi-cured adhesives. This composite approach integrates the conductive material seamlessly into the textile structure, allowing it to withstand mechanical deformation.
2Reliability
If conventional conductive materials are integrated into bond lines, then electrical functionality is achieved, but the materials are damaged during the bonding process
Solution Approach 1:
The patent applies preliminary action by using semi-cured adhesives that are not yet fully hardened during the integration process. This allows the conductive material to be gently pressed into the bond line without exposure to high heat or pressure that would damage it, while still achieving proper bonding.
Solution Approach 2:
The patent changes the thermal and mechanical parameters of the bonding process by using semi-cured adhesives at lower temperatures and pressures compared to conventional bonding processes. This parameter modification protects the sensitive conductive material from damage while ensuring proper integration.
3Reliability
If rigid conductive materials are used in textile articles, then electrical conductivity is maintained, but the articles become stiff and uncomfortable
Solution Approach 1:
The patent changes the mechanical parameters of the conductive material by selecting viscoelastic materials with appropriate elasticity and compliance. These materials maintain electrical conductivity while matching the mechanical properties of the textile, allowing the article to remain flexible and comfortable during wear.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible, stretchable, and durable electrically functional textiles by embedding conductive materials in bond lines without mechanical damage, providing protection from environmental factors.
Implementation Method 1
The functional material may have a viscous characteristic. The functional material may have an elastic characteristic. The functional material may have a viscoelastic characteristic.
Implementation Method 2
a first bonding layer bonded to the structural layer
Data Source
AI summary
A deformable assembly may include a first structural layer, a first bonding layer bonded to the structural layer, and a pattern of functional material entrapped between the first structural layer and first the bonding layer. The functional material has a viscous characteristic, an elastic characteristic and/or a viscoelastic characteristic. The assembly may further include a second structural layer bonded to the first bonding layer. The first structural layer may include a first piece of fabric, the second structural layer may include a second piece of fabric, and the functional material may be electrically conductive. The functional material may include a conductive gel. The assembly may further include a second bonding layer bonded to the first bonding layer and the first structural layer, and the pattern of functional material may be entrapped between the first and second bonding layers.

