Viscoelastic Damping Layer for Electronic Component Packaging

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Solution Overview

Problem

Electronic components used in downhole environments face reliability and durability issues due to harsh conditions such as high temperatures and vibrations, which existing packaging solutions fail to adequately address.

Innovation Solution

A solid molded housing with a viscoelastic damping layer is used to isolate electronic components from vibrations and thermal stresses, featuring a composite shell and damping mechanism that directs strain energy into the damping layer, thereby reducing resonance and thermal expansion-related stresses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional solid-molded subassemblies with potting material are used, then electronic components are protected from downhole conditions, but the components are still susceptible to vibration and thermal stress damage

Engineering Contradiction:

Improveelectronic component reliabilityVSAvoidvibration and thermal stress

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A viscoelastic damping layer is pre-installed between the PCB assembly and the housing to cushion against vibrations and thermal stresses before they occur during downhole operations. This layer absorbs and dissipates vibrational energy and accommodates thermal expansion, protecting the electronic components from damage.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The packaging employs a composite structure combining a rigid housing material (for structural support and thermal management) with a viscoelastic damping material (for vibration isolation and stress absorption). This multi-material approach leverages the complementary properties of each material to simultaneously address vibration and thermal challenges.

Inventive Principle:

Principle #40Composite materials

2Strength

If the PCB assembly is hard-mounted directly into the housing, then structural support is provided, but vibration and strain are transmitted directly to the electronic components

Engineering Contradiction:

Improvestructural supportVSAvoidvibration transmission

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The viscoelastic damping layer serves as an intermediary element between the rigid housing and the PCB assembly. It provides the necessary structural support while simultaneously isolating the electronic components from vibrational forces and strain, preventing direct transmission of mechanical stresses.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If the housing is made from a single rigid material, then structural integrity is maintained, but thermal expansion stresses are transmitted to the electronic components

Engineering Contradiction:

Improvehousing structural integrityVSAvoidthermal expansion stress

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The housing system uses a composite material approach, combining a rigid outer housing (for structural integrity and thermal conduction) with a viscoelastic inner layer (for thermal expansion accommodation). This layered composite structure allows the rigid housing to maintain strength while the viscoelastic layer absorbs thermal stresses, preventing their transmission to the electronic components.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides enhanced durability and thermal integrity for electronic components, maintaining performance in high-temperature and vibration environments, with improved thermal dissipation and reduced fatigue stresses, surpassing the robustness of prior art packaging methods.

Implementation Method 1

a viscoelastic damping layer disposed within the first portion, the viscoelastic cushion configured to damp vibrations and strain transmitted from the tool

Methodology Applied

Scientific EffectViscoelastic damping: Viscoelasticity

Implementation Method 2

the viscoelastic damping layer forming a constrained layer between the support structure and the first portion and configured to isolate the support structure from the housing

Methodology Applied

Scientific EffectConstrained layer damping: Damping

Implementation Method 3

the damping layer including a plurality of holes extending therethrough and configured to relieve stresses created by thermal expansion of the damping layer

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentEP2823145B1High temperature and vibration protective electronic component packaging

Publication Date: 2017.11.29 BAKER HUGHES CO

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AI summary

An electronic component package for installation on a tool includes: a solid molded housing configured to hold an electronic component support structure and surround electronic components disposed on the support structure; the housing including a first portion configured to hold the support structure, and a second portion forming a cavity around the electronic components disposed on the support structure and isolating the electronic components from contact with the housing; and a viscoelastic damping layer disposed within the first portion, the viscoelastic cushion configured to damp vibrations and strain transmitted from the tool, the viscoelastic damping layer forming a constrained layer between the support structure and the first portion and configured to isolate the support structure from the housing.