Viscoelastic Dielectric Member for Millimeter Wave Signal Transmission
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing anti-collision radar systems for vehicles face challenges in maintaining high-speed data transmission due to vibration-induced disconnection of connectors and cables, leading to increased device size and cost.
Innovation Solution
An in-millimeter wave dielectric transmission device utilizing a viscoelastic member with a predetermined relative dielectric constant and dissipation factor is interposed between signal processing boards to absorb vibrations and facilitate high-speed data transmission without the need for connectors or cables.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connectors and cables are used for high-speed data transmission between signal processing boards, then data transmission capability is achieved, but the device size and cost increase due to the large number of pins and complicated structure
Solution Approach 1:
The patent extracts and eliminates the connectors and cables from the signal transmission system. Instead of using traditional connectors with multiple pins and complex structures, the invention directly transmits millimeter wave signals through the dielectric member that couples the signal processing boards, thereby removing the problematic components while maintaining transmission functionality
Solution Approach 2:
The patent replaces the mechanical connection system (connectors and cables with physical pins) with an electromagnetic field-based transmission system. The millimeter wave signals are transmitted through the dielectric member without requiring mechanical contact, thus substituting a mechanical system with an electromagnetic field system that is more reliable and less complex
2Productivity
If connectors and cables are used for high-speed data transmission, then signal transmission is enabled, but vibration-induced disconnection occurs in vibration environments
Solution Approach 1:
The patent replaces the mechanical connector system with an electromagnetic coupling system through the dielectric member. This substitution eliminates the mechanical contact points that are susceptible to vibration-induced disconnection, while maintaining high-speed data transmission capability through electromagnetic signal propagation
Solution Approach 2:
The dielectric member serves as an intermediary between the signal processing boards, providing a stable medium for electromagnetic signal transmission. This intermediary structure is not subject to the same vibration-induced failure modes as mechanical connectors, thereby improving connection stability in vibration environments while enabling high-speed transmission
3Strength
If adhesive hardening type high-dielectric resin is filled in connector to robust structure, then connector reliability is improved, but device size and cost increase
Solution Approach 1:
The patent extracts and eliminates the entire connector structure from the system. Instead of reinforcing existing connectors with adhesive hardening resin, the invention removes the need for connectors altogether by using direct electromagnetic coupling through the dielectric member, thereby eliminating the source of structural complexity and cost
Solution Approach 2:
The dielectric member acts as an intermediary that provides both mechanical support and electromagnetic transmission functionality. This single component replaces the complex connector assembly, simplifying the overall device structure while maintaining the necessary signal transmission capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces vibration-induced disconnections, enabling reliable high-speed millimeter wave signal transmission in vibration environments while minimizing device size and cost.
Implementation Method 1
a viscoelastic member having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor is provided between signal processing boards to absorb vibration
Implementation Method 2
a dielectric member having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor is provided between signal processing boards for transmitting/receiving a millimeter wave signal
Data Source
AI summary
A millimeter wave transmission device, the millimeter wave transmission device with (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.