Vision-Guided Spin Coating for Repeatable Small-Wafer Baking
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Solution Overview
Problem
Existing semiconductor coating and baking apparatuses are not suitable for scientific research, leading to unsatisfactory process repeatability, low efficiency, sample waste, and health hazards due to manual handling of small wafers and contact with photoresist.
Innovation Solution
A full-automatic spin coating and baking apparatus for scientific research, incorporating a manipulator device, pipetting device, vision device, and control system, to accurately handle and process small wafers with photoresist, ensuring precise positioning and automated operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If manual handling of small wafers is used, then flexibility and cost saving are achieved, but process repeatability deteriorates and sample waste increases
Solution Approach 1:
The patent replaces manual mechanical handling with an automated manipulator system equipped with vision guidance. The manipulator uses visual recognition to locate and grasp small wafers, then automatically positions them on the spin coater and hot plate, eliminating human variability while maintaining flexibility through programmable operations.
Solution Approach 2:
The patent introduces a vision system as an intermediary between the manipulator and the wafer handling process. The vision device captures images, processes positions, and guides the manipulator's movements, enabling precise and repeatable handling of small wafers without direct human contact.
2Adaptability or versatility
If manual handling of small wafers is used, then flexibility is maintained, but sample waste increases due to fragility
Solution Approach 1:
The patent replaces fragile manual handling with a robust automated manipulator system. The manipulator uses vision-guided precise positioning and controlled grasping forces to handle small, fragile wafers without dropping or damaging them, significantly reducing sample waste while maintaining operational flexibility.
3Reliability
If automated apparatus is used, then process repeatability improves, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into an integrated automated system. The manipulator combines wafer handling, positioning, and transfer operations; the vision system integrates image capture, processing, and guidance functions; and the control system coordinates all components, achieving high repeatability while managing complexity through functional integration.
Solution Approach 2:
The patent designs the manipulator and vision system to perform multiple functions: the manipulator handles both spin coating and hot plate operations, the vision system guides both wafer placement and positioning, and the control system manages the entire process workflow, reducing overall system complexity through multi-functionality.
4Ease of operation
If manual photoresist handling is used, then operation simplicity is maintained, but health hazards increase
Solution Approach 1:
The patent replaces manual photoresist handling with an automated pipetting system. The pipetting device, controlled by the manipulator and vision system, automatically dispenses photoresist onto wafers, eliminating direct human contact with hazardous chemicals while maintaining operational simplicity through automated sequences.
5Extent of automation
If existing full-automatic apparatus is used, then automation is achieved, but adaptability to small wafers deteriorates
Solution Approach 1:
The patent applies local quality by designing the manipulator's end effector and vision system specifically for small wafer dimensions. The gripper size, positioning precision, and image processing parameters are optimized for 1cm×1cm or 2cm×2cm wafers, enabling automated handling that is specifically adapted to small wafer characteristics rather than generic wafer sizes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus reduces sample waste, improves process repeatability and efficiency, reduces labor intensity, and ensures safety by avoiding direct contact with photoresist, enhancing semiconductor research capabilities.
Implementation Method 1
a spin coating device, mounted on the apparatus body, for spin-coating the piece of wafer dripped with the photoresist
Implementation Method 2
a baking device, mounted on the apparatus body, for baking the piece of wafer subjected to spin coating
Implementation Method 3
researchers manually pick up and place a piece of wafer on a vacuum adsorption hole of the manual spin coater
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The present application discloses a full-automatic spin coating and baking apparatus for scientific research, which relates to the technical field of semiconductor spin coating and baking. The apparatus includes a main body, a first loading device, a second loading device, a manipulator device, a spin coater, a baking device, a pipetting device, a vision device and a control device. The control device is configured to accurately control the manipulator device to grab a small wafer piece from the first loading device based on the positioning recognition of the vision device, and then accurately place the grabbed small wafer piece at a vacuum adsorption hole of the spin coater. After that, the manipulator device is controlled to be linked with the pipetting device, so that the photoresist can be sucked from the second loading device and accurately dripped onto the small wafer piece fixed by adsorption. The spin coater is controlled to perform spin coating treatment on the small wafer piece dripped with photoresist. The manipulator device is controlled to grab the small wafer piece from the spin coater and place it on the baking device after the spin coating treatment is completed. The baking device is controlled to bake. After baking, the manipulator device is controlled to place the small wafer piece back into the first loading device.