2D 3D Vision Inspection System for IC Devices
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Solution Overview
Problem
Current inspection systems for IC devices are either complex and expensive, or they suffer from reduced inspection speed due to using a single camera for both 2-D and 3-D inspections, or require separate mechanisms and different centers of view for 2-D and 3-D analysis.
Innovation Solution
A compact inspection system that integrates 2-D and 3-D inspection capabilities into a single module using separate cameras and light sources, with a beam splitter aligning both systems to have the same center of view, and a high-speed CMOS sensor camera for 3-D imaging, allowing for simultaneous 2-D and 3-D analysis without the need for reorienting the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single camera is used for both 2-D and 3-D inspection, then device complexity is reduced, but inspection speed decreases due to data bottleneck
Solution Approach 1:
The inspection system is segmented into two independent camera systems: a 2-D camera for planar inspection and a 3-D camera for volumetric inspection. Each camera processes its respective data stream independently, eliminating the data bottleneck that occurs when a single camera must handle both 2-D and 3-D inspection tasks sequentially. This segmentation allows parallel processing and maintains high inspection speed.
Solution Approach 2:
The patent implements a universal inspection platform that can perform both 2-D and 3-D inspection functions simultaneously using separate cameras. The system integrates multiple inspection capabilities (2-D imaging, 3-D imaging, laser line projection) into a single multi-functional device that inspects semiconductor packages comprehensively without requiring separate inspection systems.
2Measurement precision
If separate mechanisms are used for 2-D and 3-D inspection, then inspection precision is improved, but device complexity and setup cost increase
Solution Approach 1:
The patent merges the 2-D inspection system and 3-D inspection system into a single integrated inspection platform. Both systems share common components including the laser line source, optical paths, and processing unit. The 2-D camera and 3-D camera are co-located and synchronized to inspect the same target area, reducing overall system complexity and setup cost while maintaining high inspection precision through specialized dedicated sensors for each inspection type.
3Area of stationary object
If different centers of view are used for 2-D and 3-D inspection, then inspection coverage is improved, but ease of operation decreases due to reorientation requirements
Solution Approach 1:
The patent transitions from sequential single-plane inspection to simultaneous multi-dimensional inspection by capturing both 2-D planar images and 3-D volumetric data of the same target area at the same time. The 2-D camera captures the planar view while the 3-D camera with laser line projection captures height and depth information, providing comprehensive inspection coverage without requiring device reorientation.
Solution Approach 2:
The system performs preliminary 2-D inspection to identify areas of interest, then uses this information to guide the 3-D inspection focus. The 2-D and 3-D cameras are pre-aligned to share the same center of view, allowing the system to efficiently transition between inspection modes without requiring mechanical repositioning or reorientation of the device under inspection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster and more efficient inspection of IC devices by allowing both 2-D and 3-D analysis to be performed in the same location with improved throughput and reduced setup costs, while maintaining independent operation of the 2-D and 3-D systems.
Implementation Method 1
The present invention combines 2-D and 3-D inspection function into one module with a beam splitter
Implementation Method 2
A high intensity light source, such as a laser, generates a plane of light which is reflected off the leads of the semiconductor package
Implementation Method 3
A high intensity light source, such as a laser, generates a plane of light which is reflected off the leads of the semiconductor package to a second optical sensor
Data Source
AI summary
There is disclosed an inspection system that combines 2-D inspection and 3-D inspection of the components of an electronic device into one compact module. The inspection system of the present invention comprises a 2-D image acquisition assembly for inspecting 2-D criteria of the components, a 3-D image acquisition assembly for inspecting 3-D criteria of the components, and a computer for control and data analyzing. The 3-D image acquisition assembly comprises a 3-D image sensor and a 3-D light source. The 3-D light source is preferably a laser capable of generating a planar sheet of light that is substantially perpendicular to the inspection plane of the electronic device. The 2-D image acquisition assembly comprises a 2-D sensor and a 2-D light source positioned above the holder. The 2D and 3D image acquisition assemblies are arranged so that the 2D inspection and 3D inspection can be done while the electronic device is being held in one location.