Vision Sensor 3D Model Generation for Semiconductor Chamber Inspection
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Solution Overview
Problem
Current inspection methods for semiconductor processing chambers lack precision in monitoring internal structure changes and misalignments, which can affect manufacturing process conditions.
Innovation Solution
A vision sensor system with an image scanning module, including a camera and illuminator, is used to project patterns onto targets within the chamber, allowing for the generation of three-dimensional models and measurement of physical quantities, enabling precise inspection of internal structures and misalignments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional inspection methods are used for semiconductor processing chambers, then the inspection process is simple, but the measurement precision of internal structure changes and misalignments is insufficient
Solution Approach 1:
The patent replaces conventional mechanical or contact-based inspection methods with an optical vision sensor system. The vision sensor uses light projection and imaging to detect internal structures and misalignments, eliminating the need for physical contact with the chamber components. This substitution enables high-precision measurement of internal structures without mechanical interference, directly resolving the contradiction between measurement precision and device complexity.
Solution Approach 2:
The vision sensor creates optical copies or images of the internal chamber structures by projecting light patterns and capturing reflected or transmitted light. These optical copies allow for precise digital analysis of internal structures, misalignments, and changes without physically accessing or touching the components. This copying approach enables high measurement precision while keeping the inspection system non-invasive and relatively simple to implement.
2Reliability
If conventional inspection methods are used, then the inspection apparatus is simple, but the ability to detect misalignments and state changes is insufficient
Solution Approach 1:
The patent replaces simple visual or contact-based inspection with an optical vision sensor system that uses light projection and imaging technology. This substitution provides reliable detection of misalignments and state changes through non-contact optical measurement, enhancing detection capability while avoiding the complexity of mechanical measurement systems.
Solution Approach 2:
The vision sensor acts as an intermediary between the inspection apparatus and the chamber internal structures. It uses light as a mediator to transfer information about internal structures, misalignments, and state changes to the detection system. This intermediary approach enables reliable detection without direct physical contact, reducing apparatus complexity while improving detection reliability.
3Manufacturing precision
If high-precision inspection of internal structures is performed, then manufacturing process control is improved, but the inspection time and complexity increase
Solution Approach 1:
The vision sensor system is pre-configured with projection patterns and imaging parameters optimized for detecting internal chamber structures. By preparing the optical measurement setup in advance with appropriate light patterns and detection angles, the system can perform high-precision inspections without requiring complex real-time adjustments, thereby reducing inspection time while maintaining manufacturing precision.
Solution Approach 2:
The patent replaces time-consuming mechanical measurement methods with rapid optical imaging. The vision sensor captures images of internal structures instantaneously using light, eliminating the need for slow mechanical scanning or contact measurement. This substitution enables high-precision inspection that does not increase inspection time, directly resolving the contradiction between manufacturing precision and time loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides accurate and detailed inspections of semiconductor processing chamber internals, enhancing process control and manufacturing efficiency by detecting changes and misalignments with high precision.
Implementation Method 1
an illuminator configured to project a pattern onto the target
Data Source
AI summary
A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.