Vision-Based Micro Device Transfer Alignment
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Solution Overview
Problem
Current micro device transfer systems face inaccuracies due to mechanical errors and dimensional incompatibilities between donor and receiver substrates, requiring efficient alignment and error compensation methods for precise pattern transfer.
Innovation Solution
A transfer system comprising a first holder for the substrate, a second holder for the transfer medium, with first and second alignment systems, optical encoders, a profilometer, and cameras to measure and compensate for positional and angular deviations, utilizing a hexapod for precise alignment and machine vision cameras to capture fiducial marks, ensuring accurate transfer of multiple devices or patterns across dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional transfer machines with mechanical motions are used, then transfer operation can be performed, but dimensional inaccuracy and alignment errors occur
Solution Approach 1:
The patent replaces mechanical alignment systems with a vision-based alignment system using cameras and image processing. The system captures images of fiducial marks on both donor and receiver substrates, calculates transformation matrices to determine precise positions, and compensates for dimensional inaccuracies without relying on mechanical motion accuracy. This substitution eliminates the accumulation of mechanical errors in multi-axis transfer machines.
Solution Approach 2:
The patent uses optical copying through camera imaging to create digital representations of fiducial marks on both substrates. By capturing and processing these optical copies, the system can precisely measure positions and calculate alignment transformations without physical contact or mechanical intervention, thereby achieving high accuracy independent of mechanical errors.
2Manufacturing precision
If multiple photolithography steps are used for patterning, then complex patterns can be formed, but process complexity and cost increase
Solution Approach 1:
The patent forms complete patterns directly on the donor substrate using simple photolithography or direct writing methods before transfer, rather than using multiple sequential photolithography steps during the transfer process. This preliminary pattern formation reduces the number of complex processing steps required while maintaining pattern transfer accuracy through precise vision-based alignment.
Data Source
AI summary
The present disclosure relates to transferring system and methods and more specifically to transferring multiple patterns or devices from a transfer medium to a substrate. The transferring apparatus comprising a first holder to hold a substrate, a second holder to hold a transfer medium, wherein the transfer medium comprises one of a: device or pattern, a first alignment system coupled to the second holder while the second holder moves in a first direction relative to one dimension of the substrate to transfer the device or the pattern; and a second alignment system coupled to the second holder while the second holder moves in a second direction relative to another dimension of the substrate to transfer the device or the pattern to the substrate, wherein the transferring apparatus is operable to transfer a plurality of devices and patterns to the substrate.